Semiconductor Air Conditioning Control for Stable Temperature and Humidity

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Solution Overview

Problem

Current semiconductor manufacturing processes fail to maintain stable temperature and humidity levels within the required range, leading to apparatus shutdowns and workpiece failures due to late detection of abnormalities.

Innovation Solution

A semiconductor device manufacturing system that includes a conditioner, data collector, and processor to monitor and adjust temperature and humidity levels in real-time, using sensors and data analysis to prevent failures by maintaining optimal conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature and humidity are monitored by sensors mounted to the apparatus, then temperature and humidity can be detected, but detection is delayed and adjustments cannot be made in time to prevent failures

Engineering Contradiction:
Improvetemperature and humidity detectionVSAvoidresponse time for adjustment
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The system performs preliminary action by predicting future temperature and humidity trends based on current data and historical patterns. The prediction module forecasts abnormal conditions before they occur, enabling proactive adjustments rather than reactive responses after failures have happened.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements continuous feedback by constantly monitoring temperature and humidity data, comparing it against predicted values, and automatically adjusting environmental conditions when deviations are detected. This closed-loop feedback mechanism ensures timely corrections are made to prevent manufacturing failures.

Inventive Principle:
Principle #23Feedback

2Device complexity

If traditional monitoring systems are used, then simple detection is possible, but apparatus shutdowns and workpiece failures occur due to inability to maintain stable conditions

Engineering Contradiction:
Improvemonitoring system structureVSAvoidmanufacturing process stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The prediction module acts as an intermediary between raw sensor data and control actions. It processes temperature and humidity data, predicts future conditions, and generates control signals accordingly. This intermediary layer adds intelligence to the monitoring system without requiring complete system redesign.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system performs self-service by automatically detecting deviations from optimal conditions and adjusting environmental parameters without human intervention. The prediction and control modules work autonomously to maintain manufacturing stability, reducing reliance on manual monitoring and response.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS12170214B2Semiconductor device manufacturing system and method for manufacturing semiconductor device
Publication Date: 2024.12.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12170214B2 patent drawing
  • US12170214B2 patent drawing
  • US12170214B2 patent drawing

AI summary

A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a conditioner connected to a semiconductor device manufacturing apparatus, a data collector connected to the conditioner and a processor connected to the data collector. The conditioner is configured to control a temperature and a humidity of an air and deliver the air to the semiconductor device manufacturing apparatus. The data collector is configured to collect data from the conditioner. The processor is configured to receive the data transferred from the data collector.