Semiconductor Package Air Space Antenna Dielectric Loss
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Solution Overview
Problem
Dielectric materials in semiconductor device packages can adversely affect the performance of the package by causing dielectric loss and interfering with the operation of electronic components.
Innovation Solution
A semiconductor device package design that includes a carrier, an antenna element with an exposed portion, and a conductive structure between the carrier and the antenna element, which creates an air space to accommodate the electronic component and electrically connects it to the carrier, thereby minimizing the impact of dielectric materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is used in the semiconductor device package, then the electronic component can be supported and insulated, but dielectric loss occurs and performance deteriorates
Solution Approach 1:
The patent removes dielectric material from the package structure and replaces it with air spaces. The antenna element is positioned directly over the electronic component with air as the intervening medium, eliminating dielectric loss while maintaining proper support and insulation through the conductive structure and package substrate.
Solution Approach 2:
The patent uses air as an inert medium between the antenna element and electronic component. This air space provides electrical insulation and mechanical support without the dielectric properties that cause energy loss, effectively creating an optimal electromagnetic environment for signal transmission.
2Reliability
If dielectric material is used for insulation, then electrical isolation is achieved, but signal coupling is interfered with
Solution Approach 1:
The patent extracts dielectric material from between the antenna element and electronic component, allowing direct air-mediated coupling. This eliminates the harmful dielectric interference with signal transmission while maintaining necessary electrical isolation through the conductive structure design.
3Ease of manufacture
If conventional package structure with dielectric material is used, then manufacturing is simplified, but antenna performance is degraded
Solution Approach 1:
The conductive structure serves multiple functions: it provides mechanical support for the antenna element, establishes electrical connections between components, defines the air space geometry, and acts as a reference plane for the antenna. This multi-functional design achieves improved antenna performance without significantly complicating the manufacturing process.
Data Source
AI summary
A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the antenna element. The conductive structure electrically connects the electronic component to the carrier. The carrier, the exposed portion of the antenna element, and the conductive structure define an air space to accommodate the electronic component and to space the electronic component apart from the conductive structure.