Semiconductor Air Spacer Structure for Crosstalk Reduction

Solution Overview

Problem

Semiconductor devices face challenges in scaling down while maintaining improved quality, yield, performance, and reliability, particularly due to issues with electromagnetic noise and crosstalk between conductive lines and gate structures.

Innovation Solution

The introduction of air spacers and air gaps between spacer layers in the semiconductor device design, which reduces electromagnetic noise and crosstalk by utilizing the low dielectric constant of air.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional semiconductor device structures are used, then device density can be maintained, but electromagnetic noise and crosstalk increase

Engineering Contradiction:

Improveelectromagnetic noise and crosstalkVSAvoiddevice structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Air gaps are introduced as intermediary structures between conductive elements (gate structures and conductive lines) to reduce electromagnetic coupling and crosstalk. The air gaps act as insulating mediators that physically separate conductive components while maintaining device functionality, thereby reducing electromagnetic noise without requiring complete redesign of the device architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The dielectric constant parameter is changed by replacing conventional dielectric materials with air (which has a dielectric constant of approximately 1.0) in specific regions between conductive elements. This parameter change reduces the electromagnetic field coupling strength and minimizes crosstalk and noise while preserving the overall device structure and density.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If device dimensions are scaled down, then computing ability increases, but manufacturing precision and reliability become more difficult to maintain

Engineering Contradiction:

Improvecomputing abilityVSAvoidmanufacturing precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The device structure is segmented into distinct regions with air gaps introduced between conductive elements. This segmentation approach allows for better control of electromagnetic fields and reduces interference between adjacent structures, enabling continued scaling while maintaining signal integrity and reducing manufacturing variability impacts.

Inventive Principle:

Principle #1Segmentation

3Productivity

If device dimensions are scaled down, then computing ability increases, but electromagnetic noise and crosstalk increase

Engineering Contradiction:

Improvecomputing abilityVSAvoidelectromagnetic noise and crosstalk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The dielectric constant parameter is changed by replacing conventional dielectric materials with air (which has a dielectric constant of approximately 1.0) in specific regions between conductive elements. This parameter change reduces the electromagnetic field coupling strength and minimizes crosstalk and noise while preserving the overall device structure and density.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Air gaps are introduced as intermediary structures between conductive elements (gate structures and conductive lines) to reduce electromagnetic coupling and crosstalk. The air gaps act as insulating mediators that physically separate conductive components while maintaining device functionality, thereby reducing electromagnetic noise without requiring complete redesign of the device architecture.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly reduces electromagnetic noise and crosstalk, thereby improving the performance of semiconductor devices.

Implementation Method 1

reduces electromagnetic noise and crosstalk by utilizing the low dielectric constant of air

Methodology Applied

Scientific EffectDielectric constant: Dielectric Permittivity

Data Source

PatentUS20260075922A1Semiconductor device with air spacers and method for fabricating the same

Publication Date: 2026.03.12 NAN YA TECH

AI summary

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a gate structure on the substrate; a plurality of inner spacer layers on sidewalls of the gate structure; a plurality of outer spacer layers on the plurality of inner spacer layers; a plurality of air gaps between the inner spacer layers and the outer spacer layers; a bottom dielectric layer on the substrate and laterally surrounding the outer spacer layers; a bottom capping layer on the bottom dielectric layer, the inner spacer layers, the air gaps, the outer spacer layers, and the gate structure; a conductive layer on the bottom capping layer and including a plurality of conductive wires; a top capping layer positioned on the conductive layer; and a plurality of air spacers positioned between the conductive wires.