Semiconductor Substrate Alignment Apparatus with Cross-Detection
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Solution Overview
Problem
The existing methods for aligning semiconductor substrates before bonding are complex and inefficient, requiring precise positioning of alignment marks on semiconductor substrates using imaging devices like cameras, which complicates the process.
Innovation Solution
An alignment apparatus comprising stages, detectors, moving mechanisms, and a controller to detect alignment marks on opposing surfaces of semiconductor substrates and calculate position deviations, allowing for precise alignment and positioning of the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment marks are checked using imaging devices for every semiconductor substrate, then positioning accuracy is improved, but process complexity increases
Solution Approach 1:
The patent divides the alignment verification process into two segments: a simplified initial alignment using alignment marks for all substrates, and a selective secondary alignment using inclination detection patterns only for substrates that may have positioning deviations. This segmentation reduces overall process complexity while maintaining positioning accuracy.
Solution Approach 2:
The patent introduces inclination detection patterns as an intermediary element between the alignment marks and the final positioning verification. These patterns serve as a mediator to detect substrate inclination and positioning deviations without requiring complex imaging device checks for every substrate.
2Measurement precision
If alignment marks are checked using imaging devices for every semiconductor substrate, then positioning accuracy is improved, but processing time increases
Solution Approach 1:
The alignment verification is segmented into rapid initial alignment using alignment marks and selective secondary verification using inclination detection patterns. This time-efficient segmentation avoids performing full imaging device checks on every substrate while maintaining positioning accuracy for substrates that need it.
Solution Approach 2:
Instead of performing complete imaging device alignment checks on every substrate (excessive action), the patent applies partial action by using inclination detection patterns only for substrates that exhibit positioning deviations, thereby reducing processing time while maintaining necessary positioning accuracy.
3Manufacturing precision
If precise positioning of alignment marks is performed using imaging devices, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The alignment system is segmented into a primary alignment stage using alignment marks and a secondary verification stage using inclination detection patterns. This segmentation achieves manufacturing precision through the secondary stage only when needed, reducing overall apparatus complexity.
Solution Approach 2:
Inclination detection patterns serve as an intermediary verification mechanism that simplifies the apparatus by providing a less complex alternative to full imaging device checks, while still achieving the necessary alignment precision through inclination and position deviation detection.
Data Source
AI summary
An alignment apparatus according to one embodiment, includes: a first and a second stage; a first and a second detector; a first and a second moving mechanism; and a controller. The first and second stages are configured to respectively hold a first and a second semiconductor substrate on which a first and a second alignment mark are respectively disposed. The first and second moving mechanisms are configured to respectively move the first and second stages relatively to each other. The controller is configured to perform the following (a), (b). (a) The controller control the detectors and the moving mechanisms to cause the first detector to detect the second alignment mark and to cause the second detector to detect the first alignment mark. (b) The controller calculate a position deviation between the substrates in accordance with results of the detections.