Semiconductor Package Alignment Members for Fine Pitch
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Solution Overview
Problem
Conventional semiconductor packages using TAB tape substrates face misalignment issues due to deformation under heat and pressure during die attachment, leading to reduced assembly accuracy, especially in packages with fine pitches.
Innovation Solution
Incorporating dummy patterns or alignment members on both the semiconductor die and the tape substrate, such as dummy bumps or leads, to enhance post-attachment alignment, ensuring gaps between these members are less than 2 μm for precise alignment and improved connection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment keys are used to align the semiconductor die and tape substrate, then initial alignment precision is improved, but misalignment occurs due to deformation under heat and pressure during die attachment
Solution Approach 1:
The patent applies preliminary action by forming dummy bumps and dummy leads before the actual die attachment process. These dummy structures are pre-positioned on the semiconductor die and tape substrate respectively, serving as alignment reference features that guide the bonding process. By establishing these reference features in advance, the system ensures that even when deformation occurs during heating and pressing, the alignment relationship is maintained through the predetermined dummy structure configurations.
Solution Approach 2:
The dummy bumps and dummy leads function as intermediary alignment features between the actual connection terminals. Rather than directly aligning the functional bumps and leads under heat and pressure, the patent uses these dummy intermediaries as stable reference points. The dummy structures mediate the alignment process by providing fixed geometric references that remain stable during the bonding process, thereby ensuring precise final alignment of the actual connection elements.
2Reliability
If the tape substrate is heated and pressed to connect inner leads and bumps, then electrical connection is achieved, but deformation occurs causing misalignment
Solution Approach 1:
The patent implements preliminary action by pre-forming the dummy bumps on the semiconductor die and dummy leads on the tape substrate before the bonding process. These dummy structures are created with precise dimensions and positions that account for anticipated thermal expansion and deformation. During the heating and pressing process, these pre-configured dummy features maintain their geometric relationship, ensuring that the actual bumps and leads remain aligned despite the applied heat and pressure.
Solution Approach 2:
The dummy bumps and dummy leads serve as intermediary reference features that mediate between the bonding process and the final alignment requirement. These dummy structures are positioned such that they provide stable geometric references during the deformation-causing bonding process. By using these intermediaries, the system decouples the bonding action from the alignment requirement, allowing the actual connection terminals to maintain precision even as the substrate deforms under heat and pressure.
3Productivity
If fine pitch is used to increase connection density, then device functionality is improved, but allowance for deformation is reduced increasing misalignment risk
Solution Approach 1:
The patent applies preliminary action by pre-establishing the dummy bump and dummy lead structures with precise spacing corresponding to the fine pitch requirements. These dummy features are formed before bonding with dimensions and positions that compensate for the reduced deformation allowance. By pre-configuring these reference features at the required fine pitch spacing, the system ensures that even minimal deformation during bonding does not exceed the tight alignment tolerances required for high-density connections.
Solution Approach 2:
The dummy bumps and dummy leads act as intermediary alignment references that enable fine pitch connections by providing stable geometric references. These dummy structures mediate the alignment challenge by offering fixed reference points that remain stable during the bonding process. The presence of these intermediaries allows the system to achieve and maintain the precise alignment required for fine pitch applications, effectively decoupling the connection density requirement from the alignment tolerance constraint.
Data Source
AI summary
A semiconductor package comprising alignment members is provided. The semiconductor package includes a semiconductor die, first connection terminals disposed on a first surface of the semiconductor die, and a tape substrate including a substrate portion, and second connection terminals disposed on the substrate portion and disposed corresponding to the first connection terminals. The semiconductor package further includes a first alignment member disposed on the first surface of the semiconductor die, and a second alignment member disposed on the substrate portion of the tape substrate and disposed corresponding to the first alignment member.