Semiconductor Alignment Device Using Optical Imaging
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in achieving precise alignment and bonding of individual semiconductor structures to form multi-layer semiconductor structures with increased circuit density, as existing methods struggle with accuracy and efficiency in stacking and coupling these components.
Innovation Solution
A semiconductor alignment device is developed, featuring a mounting structure with opposing portions, imaging devices for capturing alignment marks, and a processor to determine alignment errors, allowing for precise positioning and bonding of semiconductor structures using vacuum/pressure devices and imaging technologies to ensure accurate alignment and coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used to position and align semiconductor structures, then the manufacturing process can be kept relatively simple, but the alignment accuracy is insufficient to achieve high circuit density in multi-layer structures
Solution Approach 1:
The patent replaces conventional mechanical alignment methods with an optical imaging system. The alignment device uses imaging devices to capture images of alignment marks on semiconductor structures, and a processor analyzes these images to determine precise alignment errors. This optical-based approach achieves sub-micron alignment accuracy without the complexity of sophisticated mechanical positioning systems.
Solution Approach 2:
The patent uses imaging devices to create optical copies (images) of the alignment marks on semiconductor structures. These images are then processed to determine alignment errors. By working with optical copies rather than directly manipulating the physical structures during measurement, the system achieves high precision while maintaining operational simplicity.
2Manufacturing precision
If precise alignment is achieved through repeated positioning and imaging, then alignment accuracy improves, but the manufacturing time and process complexity increase
Solution Approach 1:
The patent incorporates alignment marks into the semiconductor structures during the fabrication process, before the alignment operation. These pre-positioned marks serve as reference features that enable rapid and accurate alignment. By preparing the alignment marks in advance, the system avoids time-consuming alignment procedures and achieves high precision efficiently.
Solution Approach 2:
The alignment device uses alignment marks that are inherently part of the semiconductor structure design. The structure itself provides the reference features needed for alignment, eliminating the need for external alignment fixtures or complex positioning mechanisms. The semiconductor structures essentially align themselves using their built-in marks as guides.
3Quantity of substance
If semiconductor structures are stacked to increase circuit density, then more circuitry fits in a given space, but the alignment and bonding accuracy requirements become more stringent
Solution Approach 1:
The patent implements a feedback-based alignment system where imaging devices capture images of alignment marks on stacked semiconductor structures, a processor analyzes these images to determine alignment errors, and the system uses this information to correct positioning. This closed-loop feedback mechanism ensures that each layer is accurately aligned to the previous layers, maintaining high precision even as multiple layers are stacked to increase circuit density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the alignment accuracy and bonding process, resulting in multi-layer semiconductor structures with increased circuit density and improved performance by ensuring precise alignment and secure coupling of semiconductor structures.
Implementation Method 1
The first and second mounting portions are secured to first and second semiconductor structures, respectively. The vacuum/pressure device is disposed to secure a semiconductor portion to one of the first and second opposing portions
Data Source
AI summary
In a system for aligning at least two semiconductor structures for coupling, an alignment device includes a mounting structure having at least first and second opposing portions. The alignment device also includes a first mounting portion movably coupled to the first portion of the mounting structure, the first mounting portion configured to couple to a first surface of a first semiconductor structure. The alignment device additionally includes a second mounting portion movably coupled to the second portion of the mounting structure, the second mounting portion configured to couple to a second surface of a second semiconductor structure. The alignment device further includes one or more imaging devices disposed above at least one of the first and second mounting portions of the alignment device, the imaging devices configured to capture and/or or detect alignment marks in at least the first semiconductor structure. A corresponding method for aligning two or more semiconductor structures for coupling is also provided.