Semiconductor Component Alignment Using Transmitted Internal Features
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Solution Overview
Problem
Existing semiconductor alignment methods rely on external physical edges, which are often rough and slanted, leading to precision issues and misalignment due to variance in the dicing process, especially when top and bottom surfaces lack direct correlation.
Innovation Solution
A method and system that utilize light transmission through the electronic component to capture internal features from both sides, calculating a correction value to align the bottom surface accurately with the top surface, using infrared or visible light and camera units to adjust the placement area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If alignment is based on outer physical edges, then alignment process is simple, but alignment precision deteriorates due to roughness and slanted sides caused by dicing process
Solution Approach 1:
The invention extracts and removes the harmful outer physical edges from the alignment process. Instead of using the rough, slanted outer edges caused by dicing, the method captures images of internal structures through the substrate and uses only those internal features for alignment, effectively taking out the problematic external surfaces from the alignment equation
Solution Approach 2:
The invention introduces light transmission as an intermediary medium to access internal structures. By shining light through the substrate and capturing transmitted images, the system creates a virtual view of internal alignment features without physically touching or relying on the problematic outer edges
2Reliability
If alignment structures are required on both top and bottom surfaces, then alignment correlation between surfaces is improved, but device complexity increases due to additional alignment structures
Solution Approach 1:
The invention creates a virtual copy of the internal alignment structures by capturing their image through light transmission. The captured image data serves as a digital replica of the internal features, allowing alignment calculations to be performed on this copied information without requiring physical alignment structures on both surfaces
Solution Approach 2:
The invention replaces the mechanical approach of adding physical alignment structures with an optical field-based solution. Instead of mechanically modifying the device to add alignment features, the method uses light transmission and image processing to achieve alignment correlation between surfaces
3Ease of operation
If external structures are used for alignment, then alignment process is straightforward, but alignment precision deteriorates when features are not present on both sides of the product
Solution Approach 1:
The invention transitions from two-dimensional surface feature alignment to three-dimensional internal structure alignment. By capturing images through the substrate, the method accesses alignment features in the depth dimension that are not visible on the surface, allowing precise alignment even when external features are asymmetric or missing on one side
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise alignment of semiconductor components by utilizing internal structures, improving accuracy and reliability in assembly, particularly for mini-LEDs with rough and slanted edges.
Implementation Method 1
illuminating, using a light source unit, the electronic component with light which transmits through the electronic component
Data Source
AI summary
The present disclosure relates to a technology of manufacturing electronic components, especially semiconductor components with an irregular shape. The present disclosure provides an improved alignment method and system which may be used in cases, where features on a top surface of the semiconductor component or device are not sufficient due to process limitations and where a bottom surface might also not show any alignment correlation with the top surface.