Semiconductor Alignment Jig for Precise Substrate Transfer Teaching
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Solution Overview
Problem
Existing substrate handling methods in semiconductor processing systems rely on expensive camera wafers for positioning, which require periodic calibration and are prone to inaccuracies due to human observation, and silicon substrates can slip during transfer, limiting the accuracy of centering positions established by cycling through centering sensors.
Innovation Solution
A jig comprising a disc body with fixation and verification pins is used to teach substrate handling, allowing precise alignment and registration with load locks and process chambers, eliminating the need for costly camera wafers and reducing inaccuracies by providing tactile and visual feedback for adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If camera wafers are used for positioning, then substrate transfer accuracy can be achieved, but the cost increases and periodic calibration is required
Solution Approach 1:
The patent replaces expensive camera wafers with a simple alignment jig made from inexpensive materials. The jig includes a substrate holder with alignment features that can be easily manufactured and replaced if needed, eliminating the need for costly camera wafers while maintaining positioning accuracy through mechanical alignment references.
Solution Approach 2:
The alignment jig creates a simplified copy or representation of the substrate positioning system using mechanical alignment features instead of optical camera patterns. The jig replicates the essential alignment function through physical references that are cheaper and more durable than camera wafers.
2Ease of operation
If human observation is used for positioning, then operation simplicity is maintained, but positioning accuracy deteriorates due to observation errors
Solution Approach 1:
The alignment jig serves as an intermediary tool between the operator and the substrate positioning process. It provides physical alignment references and mechanical guides that objectively define the correct position, eliminating reliance on human visual judgment while keeping the operation simple through straightforward mechanical alignment procedures.
3Measurement precision
If silicon substrates are cycled through centering sensors, then centering position can be established, but accuracy is limited due to substrate slippage during transfer
Solution Approach 1:
The alignment jig performs preliminary alignment of the substrate before it enters the centering sensor. By pre-positioning the substrate using the jig's mechanical alignment features, the substrate is already correctly oriented and positioned, preventing slippage during transfer and ensuring accurate centering measurements without requiring multiple retry cycles.
Data Source
AI summary
A jig includes a disc body, a fixation pin, and a verification pin. The disc body has a first surface, an opposite a second surface, and a thickness separating the first surface from the second surface. A fixation aperture and a verification aperture extend through the thickness of the disc body and couple the first surface to the second surface of the disc body, the fixation aperture located radially outward of the verification aperture. The fixation pin is arranged to be slidably received within the fixation aperture to fix the disc body to an end effector within the semiconductor processing system. The verification pin is arranged to be slidably received within the verification aperture and supported by the disc body to indicate misregistration between the disc body and a load lock in the semiconductor processing system.