Semiconductor Package Alignment Patterns for Precision Integration
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Solution Overview
Problem
Current semiconductor packaging methods face challenges in miniaturization and high-performance integration, particularly in maintaining alignment accuracy and electrical connectivity as package sizes decrease, with existing methods struggling to ensure reliable connections and alignment patterns.
Innovation Solution
The semiconductor package incorporates a first and second redistribution layer, dielectric layers, and alignment patterns formed using a laser to enhance alignment accuracy and electrical connectivity, with a mold layer and posts providing structural support and electrical connections, and additional alignment patterns to compensate for potential deformation during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If package size is reduced for miniaturization, then productivity and integration density are improved, but manufacturing precision and alignment accuracy deteriorate
Solution Approach 1:
Alignment patterns are formed on the semiconductor chip surface before packaging, allowing alignment information to be prepared in advance. This preliminary action enables accurate alignment during subsequent packaging processes even as package sizes decrease, resolving the contradiction between miniaturization and alignment precision.
Solution Approach 2:
The alignment patterns serve as an intermediary element between the semiconductor chip and the packaging structure. These patterns provide reference marks that facilitate precise alignment during assembly, enabling high integration density while maintaining manufacturing precision through the mediating alignment features.
2Reliability
If redistribution layer is added for fan out wiring, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The alignment patterns and dielectric layer structures are merged with the redistribution layer system. The same dielectric layers that provide electrical insulation for the redistribution wiring also serve as the medium in which alignment patterns are formed, combining multiple functions into integrated structures and reducing overall device complexity while maintaining electrical connectivity.
3Manufacturing precision
If alignment patterns are formed on chip surface, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The dielectric layers serve multiple functions: they provide electrical insulation for the redistribution layer, structural support for the alignment patterns, and a medium for forming the alignment patterns themselves. This multi-functionality allows alignment patterns to be formed without adding separate dedicated structures, improving manufacturing precision while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and accuracy of semiconductor package assembly by maintaining precise alignment and electrical connectivity, addressing the limitations of miniaturization and high-performance integration in semiconductor devices.
Implementation Method 1
alignment patterns formed using a laser to enhance alignment accuracy
Data Source
AI summary
A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.