Semiconductor Analyte Sensor with Conductive Core
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Solution Overview
Problem
Conventional analyte sensors for continuous monitoring face challenges due to mechanical properties like low tensile strength and susceptibility to embrittlement, making them difficult to fabricate in small sizes for minimally invasive implantation and increasing costs due to the need for expensive materials like platinum for coating.
Innovation Solution
An analyte sensor with a substrate comprising a conductive core and a semiconductor cladding, such as silicon carbide, providing a conductive path for the working electrode with enhanced mechanical strength and reduced material costs, allowing for smaller sizes and flexible implantation without discomfort.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If tantalum substrate is used for continuous monitoring sensor, then the sensor can be fabricated with conventional materials, but the tensile strength is low making it difficult to fabricate small dimensions below 350 micron diameter
Solution Approach 1:
The patent employs a composite structure consisting of a tantalum substrate combined with a platinum coating layer. This composite approach allows the sensor to achieve both the mechanical properties of tantalum and the electrochemical stability of platinum, enabling fabrication of small-diameter sensors (below 350 microns) with sufficient tensile strength while maintaining functionality for continuous monitoring applications
2Reliability
If tantalum substrate is used for analyte sensor, then the sensor can be manufactured with conventional materials, but it is susceptible to embrittlement when exposed to hydrogen requiring complete platinum coating
Solution Approach 1:
The patent applies platinum coating selectively to specific regions of the tantalum substrate where electrochemical reactions occur, rather than providing complete coverage. This local quality approach ensures that the platinum protects the tantalum from hydrogen embrittlement only in the active working electrode regions, reducing overall platinum consumption while maintaining sensor reliability and resistance to embrittlement
3Reliability
If complete platinum coating is applied to tantalum substrate to avoid hydrogen embrittlement, then the sensor reliability is improved, but the expense of the sensor increases considerably
Solution Approach 1:
The patent implements selective platinum coating on only the active working electrode regions of the tantalum substrate, reducing the quantity of expensive platinum material required while maintaining sensor reliability. This approach significantly lowers material costs compared to complete coating, making the sensor more economically viable for continuous monitoring applications
4Ease of operation
If sensor diameter is reduced to avoid pain and discomfort during insertion, then patient comfort is improved, but fabrication difficulty increases due to low tensile strength of conventional substrates
Solution Approach 1:
The patent utilizes a composite structure of tantalum substrate with platinum coating that provides enhanced mechanical strength. This composite material enables the fabrication of small-diameter sensors (below 350 microns) that are sufficiently strong for minimally invasive insertion, improving patient comfort while remaining manufacturable with conventional fabrication techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor achieves robust mechanical properties and electrochemical stability, enabling minimally invasive implantation and continuous monitoring with reduced material costs, while maintaining accurate analyte detection capabilities.
Implementation Method 1
a substrate including semiconductor material that forms at least a portion of a conducting path for a working electrode of the analyte sensor
Data Source
AI summary
An analyte sensor is provided that comprises a substrate which includes a semiconductor material. Embodiments may include a core of a conductive material, and a cladding of a semiconductor material, in which the cladding may form at least a portion of a conducting path for a working electrode of the analyte sensor. Method of manufacturing and using the analyte sensor are described, as are numerous other aspects.