Semiconductor Package Anchor Conductive Layer
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to inefficiencies in manufacturing and potential structural failures due to mechanical or thermal stress.
Innovation Solution
A semiconductor package design featuring a conductive layer with an anchor region that extends through at least one dielectric layer, providing stability and preventing cracks or delamination by anchoring the conductive layer to the semiconductor die, and an under bump metal structure connected to the anchor region for enhanced structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor package structures are used, then manufacturing processes are simpler, but reliability decreases due to cracks and delamination under mechanical or thermal stress
Solution Approach 1:
The conductive layer is divided into multiple segments: a first conductive layer with anchor portions extending into openings in the dielectric layer, and a second conductive layer formed afterward. This segmentation allows each layer to perform specific functions - the first layer provides mechanical anchoring while the second layer provides electrical connectivity, thereby preventing delamination and cracks while maintaining manufacturing feasibility
Solution Approach 2:
The conductive layer transitions from a purely two-dimensional planar structure to a three-dimensional structure with anchor portions that extend vertically into the dielectric layer. This dimensional change creates mechanical interlocking that prevents delamination and crack propagation, significantly improving structural reliability without excessively complicating the manufacturing process
2Ease of manufacture
If conventional conductive layer designs are used, then manufacturing costs are lower, but package size increases and manufacturability decreases
Solution Approach 1:
The first conductive layer with anchor portions is formed in advance, extending into openings in the dielectric layer before the second conductive layer is deposited. This preliminary action creates a pre-prepared anchoring structure that simplifies subsequent manufacturing steps and improves overall manufacturability, even though it adds initial structural complexity
Solution Approach 2:
The anchor portions of the first conductive layer are nested within openings in the dielectric layer, creating a interlocked structure. This nesting approach allows the conductive layers to be embedded within the dielectric matrix, reducing overall package size while improving ease of manufacture through integrated structure formation
3Reliability
If conventional conductive layer configurations are used, then manufacturing costs are reduced, but reliability decreases due to excessive package size and structural failures
Solution Approach 1:
The dielectric layer has non-uniform properties with openings strategically positioned to receive anchor portions of the conductive layer. This local variation in dielectric structure creates targeted mechanical anchoring zones that prevent delamination and crack propagation, improving reliability while minimizing the overall quantity of material required in the package structure
Solution Approach 2:
The package structure combines multiple materials with different properties: dielectric material providing mechanical support and insulation, and conductive materials providing electrical connectivity and structural anchoring. This composite approach creates a multi-functional structure that improves reliability through material synergies while optimizing package size by eliminating redundant materials
Data Source
AI summary
A semiconductor package and a method of making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a conductive layer that comprises an anchor portion extending through at least one dielectric layer.