Semiconductor Device Anchor Part Heat Dissipation
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Solution Overview
Problem
Semiconductor devices such as IGBTs and MOSFETs generate significant heat, leading to potential breakdown and reliability issues due to inadequate heat dissipation.
Innovation Solution
A semiconductor device design featuring a plate-shaped lead part with an anchor part and a sealing material that seals the semiconductor element, connection member, and connection terminal, with the anchor part protruding to enhance heat dissipation and prevent moisture ingress, thereby improving thermal conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the semiconductor device uses large currents and voltages to achieve required power conversion, then the power conversion capability is improved, but heat generation increases causing reliability deterioration
Solution Approach 1:
The connection terminal extends in multiple dimensions with an anchor part protruding from the side surface perpendicular to the bonding area. This three-dimensional structure increases the heat dissipation surface area and creates multiple thermal conduction paths, allowing efficient heat removal while maintaining high power conversion capability
Solution Approach 2:
The anchor part acts as an intermediary thermal conduction path between the connection terminal and the surrounding structure. It provides an additional heat dissipation route that complements the bonding area, effectively reducing heat accumulation and improving device reliability under high power operation
2Ease of manufacture
If the anchor part protrusion length is uniform across the connection terminal, then manufacturing simplicity is maintained, but heat dissipation efficiency and sealing quality deteriorate
Solution Approach 1:
The connection terminal features non-uniform anchor part protrusion lengths at different locations. The varying protrusion lengths are optimized for local heat dissipation requirements and sealing needs, with longer protrusions in areas requiring enhanced thermal management and shorter ones where compactness is prioritized
Solution Approach 2:
The protrusion length of the anchor part is varied as a design parameter across different positions of the connection terminal. This parameter change allows optimization of heat dissipation efficiency and sealing quality at each location while maintaining manufacturing feasibility through controlled variation
3Strength
If the bonding area is fully exposed to improve bonding quality, then bonding strength is improved, but moisture ingress risk increases causing reliability deterioration
Solution Approach 1:
The connection terminal structure acts as a protective shell that covers and seals the bonding area. The anchor part extending from the side surface creates a barrier that prevents moisture ingress to the bonding interface, while the bonding area remains sufficiently exposed to maintain strong bonding between the connection terminal and bonding pad
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively enhances heat dissipation and maintains reliable bonding between components, reducing the risk of semiconductor device failure under thermal stress.
Implementation Method 1
the anchor part having a second front surface on a plane of the first front surface, and a second side surface between the second front surface and the rear surface at a side where one of the first side surfaces of the lead part is located
Implementation Method 2
a sealing material that seals the semiconductor element, the connection member, and a part of the connection terminal
Data Source
AI summary
A semiconductor device includes a semiconductor element, a bonding wire that is electrically connected to the semiconductor element, a connection terminal, and sealing material that seals the semiconductor element, the bonding wire, and a part of the connection terminal. In addition, the connection terminal includes a plate-shaped lead part having a bonding area to which the bonding wire is bonded and an anchor part protruding from a first side part of the lead part. In the semiconductor device, since the rear surface of a die pad and the rear surface of the lead part exposed to the outside in a sealing main surface of the sealing material occupy a predetermined area or more, the heat dissipation of the semiconductor device is improved.