Semiconductor Device Anchor Means for Resin Adhesion
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Solution Overview
Problem
In semiconductor devices with a Chip On Tape (COT) package, the adhesiveness between the terminal surface and the resin is low, leading to potential electrical disconnection under stress, affecting the reliability of the joint portion.
Innovation Solution
A semiconductor device design featuring a base material with through holes, external terminals, and a semiconductor chip mounted face-up, where a conductive member connects the terminal to the chip, and an anchor means is provided on the exposed surface to enhance adhesiveness and reliability, with a sealing body covering the conductive member and chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive member is connected to the terminal surface via a through hole in the base material, then electrical connection is achieved, but adhesiveness between the terminal surface and resin is low leading to potential disconnection under stress
Solution Approach 1:
An anchor means is formed on the terminal surface before the resin sealing process. This preliminary structural preparation creates mechanical interlocking features that prevent resin detachment later, resolving the adhesion problem without affecting the electrical connection function.
Solution Approach 2:
The anchor means is specifically located at the terminal surface region where adhesion is needed, while leaving other regions unchanged. This localized modification improves resin bonding at the critical joint portion without altering the overall device structure or electrical properties.
2Reliability
If the terminal surface is exposed from the through hole for conductive member connection, then electrical connection is enabled, but the exposed surface lacks sufficient bonding area for resin adhesion
Solution Approach 1:
The anchor means extends in the thickness direction of the base material, creating a three-dimensional bonding structure. This vertical dimensionality increase provides additional bonding area for the resin without expanding the planar footprint, thus maintaining electrical connection while improving adhesion.
Solution Approach 2:
The anchor means is nested within the through hole structure, utilizing the existing spatial configuration. The anchor protrudes into the through hole space, effectively using the available volume to create bonding features without adding external complexity to the device.
Data Source
AI summary
Reliability of a semiconductor device is improved. A semiconductor device has a base material of insulating material having a through hole, a terminal formed on a lower surface of the base material, and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. The semiconductor device has a conductive member such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole of the base material, and has a sealing body for sealing the conductive member, inside of the through hole of the base material, and the semiconductor chip. An anchor is provided in a region of the exposed surface of the terminal which is exposed from the through hole of the base material except for a joint portion joined with the conductive member.