Radiation-Emitting Semiconductor Device Anchoring Structure for Fabric Integration
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Solution Overview
Problem
Existing radiation-emitting semiconductor devices, such as light-emitting diode chips, face challenges in stable and efficient mounting on fibers or threads, often requiring intermediate carriers and cumbersome gluing processes.
Innovation Solution
A radiation-emitting semiconductor device with a semiconductor layer sequence integrated into a fabric using anchoring structures that allow direct attachment and electrical contacting via threads, enabling efficient mechanical and electrical integration into textiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If semiconductor devices are mounted on intermediate carriers using gluing processes, then mechanical stability is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts and eliminates the intermediate carrier from the mounting system. The anchoring structures are integrated directly into the semiconductor device housing, allowing direct attachment to fibers without requiring separate intermediate carriers or gluing processes.
Solution Approach 2:
The patent merges the mechanical anchoring function and electrical contact function into a single integrated structure. The anchoring structures serve dual purposes: providing mechanical stability through direct fiber attachment and enabling electrical contacting, thereby eliminating the need for separate mounting and contacting components.
2Ease of manufacture
If anchoring structures are integrated directly into the semiconductor device, then ease of manufacture improves, but mechanical stability may be compromised
Solution Approach 1:
The anchoring structures are designed as multi-functional elements that simultaneously provide mechanical anchoring to fibers and electrical contact to the semiconductor device. This universal design simplifies manufacturing by eliminating separate components while maintaining both mechanical stability and electrical functionality.
Solution Approach 2:
The anchoring structures are strategically positioned and designed with specific geometric features at critical locations on the semiconductor device housing. This localized design optimizes both the mechanical attachment strength to fibers and the electrical contact quality at specific points, ensuring stability while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables stable and efficient integration of semiconductor devices into fabrics, allowing for the creation of luminous tissues that emit light via electroluminescence, suitable for applications in safety clothing, fashion, and other uses.
Implementation Method 1
a radiation-emitting semiconductor device, in particular a light-emitting diode (LED) chip, is difficult to mount on fibers... the semiconductor layer sequence is designed as a light emitting diode chip... the active zone for the generation of radiation
Data Source
AI summary
A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.