Semiconductor Package Antenna Cavity for Compact RF Performance
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The development of a semiconductor device with an antenna structure that includes a dielectric structure and a conductive structure, featuring an air cavity and antenna elements supported by dielectric materials, which enhances antenna performance and reduces package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and performance is low
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional antenna structures that extend vertically above the substrate. The antenna element is positioned in a cavity formed in the encapsulant material, creating vertical spacing and improving radiation performance while reducing the horizontal footprint of the package.
Solution Approach 2:
The antenna element is nested within a cavity formed in the encapsulant material, which itself is embedded in the semiconductor package structure. This nested arrangement allows the antenna to be integrated within the package volume rather than requiring additional external space.
2Ease of manufacture
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is excessive
Solution Approach 1:
The patent combines the antenna element, encapsulant material, and semiconductor substrate into a single integrated structure. The encapsulant serves dual functions as both protective packaging material and structural support for the antenna element, eliminating the need for separate antenna housing components.
Solution Approach 2:
The encapsulant material performs multiple functions: it provides mechanical protection for the semiconductor device, forms the structural cavity for the antenna element, and serves as the mounting medium for the antenna. This multi-functionality reduces the number of separate components and assembly steps required.
3Ease of manufacture
If conventional semiconductor packages are used, then manufacturing is simpler, but antenna performance is suboptimal
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional antenna structures that extend vertically above the substrate. The antenna element is positioned in a cavity formed in the encapsulant material, creating vertical spacing and improving radiation performance while reducing the horizontal footprint of the package.
Solution Approach 2:
The patent creates a localized region with different electromagnetic properties by forming a cavity in the encapsulant material. This cavity provides a specific dielectric environment around the antenna element that optimizes radiation characteristics, while the rest of the package maintains its standard structure.
Data Source
AI summary
A semiconductor device includes a substrate including a conductive transceiver pattern proximate to the substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the conductive transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. A semiconductor component is coupled to the substrate bottom side and the transceiver pattern.