Semiconductor Package Antenna Shielding for High-Speed EMI Isolation
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Solution Overview
Problem
Semiconductor devices with high-density integrated circuitry are susceptible to electromagnetic interference (EMI) as communication speeds increase, leading to interference between the semiconductor die and antenna structures, which affects device performance.
Innovation Solution
Incorporating an electromagnetic interference (EMI) shield between the semiconductor die and antenna structure, electrically coupled to a ground plane, with dielectric materials separating the shield from both the die and antenna, to prevent electromagnetic radiation and crosstalk, and using a package molding to encapsulate the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If communication transfer speeds are increased to implement 5G or later wireless technology, then communication performance is improved, but the semiconductor components become susceptible to electromagnetic interference (EMI)
Solution Approach 1:
An EMI shield is introduced as an intermediary component between the antenna structure and the semiconductor die. The shield is electrically coupled to a ground plane and positioned adjacent to the antenna, creating a protective barrier that blocks electromagnetic interference from reaching sensitive circuit components while allowing high-speed communication signals to pass through
2Object-affected harmful factors
If an EMI shield is added between the antenna and semiconductor die, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The EMI shield structure is designed to serve multiple functions simultaneously: it provides electromagnetic interference shielding, acts as a structural support element, and can be integrated with existing package substrates. The shield is electrically coupled to the ground plane through conductive materials, creating a multi-functional component that reduces overall device complexity despite adding protection capabilities
Solution Approach 2:
The EMI shield is nested within the existing package structure, positioned between the antenna and the semiconductor die. The shield integrates with the package substrate and ground plane, fitting into the existing architectural framework rather than requiring complete structural redesign, thereby minimizing the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EMI shield effectively reduces interference, allowing semiconductor devices to operate at higher communication speeds without electrical noise, enhancing performance and reliability.
Implementation Method 1
An electromagnetic interference (EMI) shield is between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure
Implementation Method 2
A first dielectric material and/or a thermal interface material can be between the semiconductor die and the EMI shield, and a second dielectric material can be between the EMI shield and the antenna structure
Data Source
AI summary
Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.