Semiconductor Antenna Structure with Opposite-Surface Redistribution Layer
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Solution Overview
Problem
Existing radio frequency chip packaging structures using plastic materials for antennas result in significant signal loss and limited flexibility in arranging antenna structures relative to the chip.
Innovation Solution
A semiconductor structure with an antenna substrate featuring a redistribution layer and an antenna module on opposite surfaces, utilizing substrates like glass, silicon, or polymer, with antenna units arranged in layers and connected by dielectric layers, allowing for reduced signal loss and flexible chip bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plastic packaging material is used for antenna substrate, then the chip can be packaged and protected, but the antenna signal loss increases significantly
Solution Approach 1:
The patent applies composite materials by combining a metal layer (aluminum or copper) with a dielectric layer (polymer material) to form a layered antenna structure. The metal layer serves as the antenna element while the dielectric layer provides structural support and electrical insulation. This composite structure reduces signal loss compared to using plastic alone, while maintaining the protective packaging function.
2Ease of manufacture
If antenna is fabricated only on the surface of plastic packaging material, then the packaging process is simplified, but the flexibility in arranging antenna structures relative to the chip is limited
Solution Approach 1:
The patent extends the antenna structure from a single surface fabrication to a three-dimensional layered configuration. The antenna includes a metal layer and a dielectric layer arranged in stacked layers, allowing the antenna elements to be positioned at different heights and orientations. This vertical dimensionality provides greater flexibility in arranging antenna structures relative to the chip while maintaining manufacturing feasibility through layer-by-layer fabrication processes.
3Adaptability or versatility
If multiple layers of antenna units are stacked with spaces between them, then the antenna arrangement flexibility is improved, but the device complexity increases
Solution Approach 1:
The patent segments the antenna into multiple discrete units arranged in stacked layers with spaces between them. Each antenna unit can be independently designed and positioned, allowing flexible spatial arrangement for different communication requirements. The segmentation approach manages complexity by creating modular, repeatable units rather than a monolithic complex structure.
Data Source
AI summary
The present disclosure provides a semiconductor structure with an antenna and a method making the same. The semiconductor structure has an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module disposed on the first surface of the antenna substrate; and a redistribution layer disposed on the second surface of the antenna substrate. The semiconductor structure with the antenna according to the present application provides the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.