Semiconductor and Antenna Package Alignment via Segmented Wafer Processing
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving precise alignment and efficient integration of semiconductor dies and antenna packages, leading to reduced yield and increased costs due to limitations in verification testing and packaging methods.
Innovation Solution
A method for manufacturing a package structure that involves a carrier with a debond layer and buffer layer, redistribution circuit structures, through vias, semiconductor dies, and insulating encapsulation, along with alignment marks and redistribution circuit structures, enabling accurate alignment and integration of semiconductor and antenna packages through a series of processing steps including planarization and debonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer level packaging is used to process and package semiconductor dies, then manufacturing efficiency is improved, but alignment precision between semiconductor dies and antenna packages deteriorates
Solution Approach 1:
The patent divides the packaging process into separate stages: wafer level processing for semiconductor dies, then individual package assembly for antenna integration. This segmentation allows each stage to be optimized independently - wafer level processing maintains high productivity while individual package assembly ensures precise alignment through manual or automated picking and placement procedures.
Solution Approach 2:
The patent performs preliminary processing of semiconductor dies at the wafer level before final package assembly. Alignment marks are prepared in advance on the wafer, and dies are pre-processed with necessary structures. This preliminary action enables efficient batch processing while preserving the capability for precise alignment during the subsequent individual package assembly stage.
2Device complexity
If conventional packaging methods are used, then process simplicity is maintained, but verification testing capability deteriorates
Solution Approach 1:
The patent introduces a vertical stacking dimension to the packaging structure, placing the antenna package above the semiconductor die with intermediate layers for electrical connection. This three-dimensional arrangement enables additional testing interfaces and verification points without significantly complicating the base packaging process, allowing comprehensive testing while maintaining relative process simplicity.
Solution Approach 2:
The patent incorporates intermediate structures such as redistribution circuit structures, insulating encapsulation layers, and connection interfaces between the semiconductor die and antenna package. These intermediary elements serve dual purposes: they enable electrical connections and mechanical support while also providing accessible points for verification testing, thus enhancing testing capability without requiring complete process redesign.
3Manufacturing precision
If precise alignment of semiconductor dies and antenna packages is achieved, then packaging quality is improved, but manufacturing cost increases
Solution Approach 1:
The patent segments the manufacturing process into high-volume wafer level processing for semiconductor dies and lower-volume precision assembly for antenna integration. This allows the majority of production to occur at low cost through batch processing, while precise alignment is applied only to the antenna package assembly stage where it is most critical, thereby controlling overall manufacturing cost while maintaining high packaging quality.
Solution Approach 2:
The patent incorporates alignment marks and self-aligning features in the package structure that enable automated alignment systems to achieve precise positioning without requiring complex manual intervention. The alignment marks are integrated into the existing wafer processing structures, allowing the system to self-correct and self-align during automated assembly, reducing labor costs while maintaining high precision.
Data Source
AI summary
A package structure includes a chip package and an antenna package. The chip package includes at least one semiconductor die and a first insulating encapsulation encapsulating the at least one semiconductor die. The antenna package is located on and electrically coupled to the chip package. The antenna package includes metallic patterns embedded in a second insulating encapsulation, wherein each of the metallic patterns has a first surface, a second surface opposite to the first surface and a side surface connecting the first surface and the second surface, wherein the first surface and the side surface of each of the metallic patterns are covered by the second insulating encapsulation, and the second surface is levelled and coplanar with a third surface of the second insulating encapsulation. A method of manufacturing a package structure is also provided.