Semiconductor Aperture Antenna Integration
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Solution Overview
Problem
Conventional semiconductor structures for wireless communication devices face challenges in achieving compact design and reduced device size due to separate manufacturing and electrical connection of antennas and communication modules, which incur higher manufacturing costs and complicate the fabrication of small antenna circuits.
Innovation Solution
A semiconductor package design that integrates a substrate with a circuit portion and an antenna, where the circuit portion includes wave guiding slots and microstrip lines arranged in an array, overlapping with the antenna, and a chip electrically connected to the circuit portion, allowing for efficient wireless signal radiation and improved antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are separately manufactured and electrically connected after being placed on the circuit board, then the manufacturing flexibility is maintained, but the manufacturing costs increase and the device size cannot be reduced
Solution Approach 1:
The patent combines the antenna and communication module into a single integrated semiconductor package structure. The antenna is formed on the back surface of the substrate while the communication module is mounted on the front surface, with both electrically connected through conductive vias that pass through the substrate. This integration eliminates the need for separate manufacturing and assembly processes, reducing both manufacturing costs and device size while maintaining manufacturing flexibility through standard semiconductor fabrication processes.
2Volume of moving object
If a physically small antenna structure is used, then the device size is reduced, but the fabrication of interconnections becomes difficult as they become an appreciable fraction of a wavelength
Solution Approach 1:
The patent transitions the interconnection structure from a planar two-dimensional layout to a three-dimensional vertical structure. Conductive vias are formed that extend vertically through the substrate, allowing interconnections to traverse the substrate thickness rather than spanning large horizontal distances. This vertical routing approach enables compact antenna designs at millimeter-wave frequencies by reducing the horizontal interconnection length to a small fraction of the wavelength while maintaining reliable electrical connections.
3Device complexity
If the antenna is integrated with the communication module on the same substrate, then the device size is reduced and manufacturing costs are lowered, but the signal loss increases and bandwidth decreases
Solution Approach 1:
The patent introduces a ground plane layer as an intermediary structure between the antenna and the communication module. This ground plane serves multiple functions: it provides electromagnetic shielding to reduce interference, acts as a reference plane for impedance control, and enhances the antenna's radiation efficiency. The ground plane is positioned on the same substrate as the antenna but electrically isolated through via structures, allowing it to mediate the electromagnetic field distribution and reduce signal losses while maintaining the integrated compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances antenna efficiency by reducing signal loss, increasing bandwidth, and achieving compact size with improved directivity and gain, while reducing electromagnetic interference and manufacturing costs.
Implementation Method 1
The circuit portion is formed on the first surface of the substrate and includes a wave guiding slot and a microstrip line overlapped with the wave guiding slot up and down
Implementation Method 2
The antenna is formed on the second surface of the substrate and overlapped with the wave guiding slot up and down
Data Source
AI summary
The semiconductor package includes a first substrate having a first surface and a second surface opposite to the first surface. A circuit portion is formed on the first surface of the substrate, wherein the circuit portion includes a wave guiding slot and a microstrip line overlapping the wave guiding slot. A chip is disposed on the circuit portion. An antenna is formed on the second surface of the substrate, wherein the antenna overlaps the wave guiding slot.