Semiconductor Passive Element Array Layout With Single-Photomask Splicing

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Solution Overview

Problem

The manufacturing of large semiconductor dies requires multiple photolithography processes due to the increase in the number of photomasks needed for each layer, leading to increased costs and complexity.

Innovation Solution

A semiconductor structure and manufacturing method that uses a single photomask to form an array of passive elements, contact members, and a redistribution layer, reducing the need for multiple photomasks by splicing exposures across different subregions of the die.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple photomasks are used for each layer including redistribution layer, via, passive element, then the large die can be manufactured, but the manufacturing cost increases

Engineering Contradiction:

Improvedie sizeVSAvoidmanufacturing cost

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

A single photomask is designed to perform multiple functions by incorporating different pattern regions for different layers (redistribution layer, via, passive element) within the same mask. This allows one photomask to replace what would traditionally require multiple separate photomasks, reducing manufacturing cost while still enabling large die production through spliced photolithography processes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If multiple photomasks are used for each layer, then the large die can be manufactured, but the number of photomasks required increases

Engineering Contradiction:

Improvedie sizeVSAvoidnumber of photomasks

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

Multiple pattern designs for different layers (redistribution layer, via, passive element) are merged into a single photomask structure. The photomask contains different pattern regions that correspond to different layers, allowing all these patterns to be formed using one photomask through spliced photolithography, thereby reducing the total number of photomasks required from multiple to just one.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If different photomasks are used for different products, then product customization is achieved, but the manufacturing cost increases

Engineering Contradiction:

Improveproduct customizationVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The single photomask is designed with different pattern regions that can be selectively activated or deactivated based on product requirements. Each region of the photomask corresponds to a specific layer or feature type, allowing customization of different products by selecting which pattern regions to use, while maintaining the benefit of using only one photomask regardless of the product configuration.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250273472A1Semiconductor structure and manufacturing method thereof

Publication Date: 2025.08.28 POWERCHIP SEMICON MFG CORP

AI summary

Disclosed is a semiconductor structure and a manufacturing method thereof. The manufacturing method of the semiconductor structure includes the following steps. A plurality of passive elements are formed in a substrate. The plurality of passive elements are arranged in an array in the substrate. A plurality of contact members are formed on the plurality of passive elements. The plurality of contact members correspond to the plurality of passive elements. A redistribution layer is formed on the substrate. The redistribution layer is electrically connected to a part of the plurality of passive elements through a part of the plurality of contact members.