Semiconductor Assembly Layout for Balanced Parallel Current Paths
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Solution Overview
Problem
In semiconductor assemblies, uneven current distribution among parallel-connected semiconductor elements leads to hotspots, reducing service life due to uneven heating and parasitic impedances, and existing solutions do not effectively balance current path impedances, resulting in reduced reliability and increased costs.
Innovation Solution
A semiconductor assembly with an insulating substrate and connection element, where conductor tracks are electrically insulated, and semiconductor elements are connected via bond connection means to balance current path impedances, with electrically conductive connection means arranged in parallel and transverse to the current direction, incorporating shunt resistors for impedance balancing and measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor elements are connected in parallel to increase current capacity, then the current carrying capability is improved, but uneven current distribution occurs leading to hotspots and reduced service life
Solution Approach 1:
The patent applies asymmetry by intentionally creating different path lengths for current flow through the semiconductor elements. The first semiconductor element has a shorter current path while the second has a longer current path, which compensates for differences in parasitic impedances and achieves more uniform current distribution among parallel-connected elements, preventing hotspots and improving reliability
2Device complexity
If conventional wiring patterns are used to connect semiconductor elements, then the device complexity is reduced, but parasitic impedances cause uneven current distribution and hotspots
Solution Approach 1:
The patent applies local quality by optimizing the wiring pattern specifically for the parallel-connected semiconductor elements. Different wiring configurations are used for different elements - the first element connects with a first wiring pattern while the second element connects with a second wiring pattern - to compensate for local differences in parasitic impedances and achieve uniform current distribution
3Reliability
If larger semiconductor elements are used to handle uneven current distribution, then the reliability is improved, but the manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent applies parameter changes by modifying the current path length parameter to achieve uniform current distribution. By adjusting the path length parameter - making the first path shorter and the second path longer - the design achieves reliable operation with standard-sized semiconductor elements, avoiding the need for larger, more expensive components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves even heating of semiconductor elements, extending service life and reducing costs by allowing the use of smaller, more flexible components with improved heat dissipation, while eliminating the need for additional shunt modules and ensuring reliable current symmetry.
Implementation Method 1
the electrically conductive connection means are dimensioned and/or arranged in such a way that the current path impedances of the respective current paths are substantially balanced
Implementation Method 2
the second conductor track and the third conductor track each have a measuring tap, which is configured to detect a current through the shunt resistors
Data Source
AI summary
A semiconductor assembly includes semiconductor elements connected to a first conductor track of a substrate. A current path impedance is embodied from each semiconductor element to a connection element. A first bond connector connects a contact surface on a substrate-distal side of each semiconductor element to a second conductor track of the substrate. Electrically conductive parallel connections transverse to a current direction connect the second conductor track to a third conductor track of the substrate. The third conductor track is connected to the connection element. The electrically conductive connections are dimensioned and/or arranged to substantially balance the current path impedances of the current paths from the semiconductor elements to the connection element. A second bond connector connects the third conductor track to the connection element. The second and third conductor tracks of the substrate each have a measurement tap to detect a current through the electrically conductive connections.