Semiconductor Assembly Carbon Layer Heat Pipe Cooling
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Solution Overview
Problem
High-power semiconductor assemblies face cooling limitations due to excessive heating, particularly during high switching frequencies and cyclic operations, leading to temperature constraints that limit the utilization of semiconductor devices.
Innovation Solution
A carbon-based material layer is integrated between the base plate of the power electronic module and the cooling arrangement with heat pipes, enhancing heat transfer and distribution across a larger surface area, allowing for more effective heat removal and adaptation to deformed base plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power semiconductors are operated at high switching frequencies, then the output power can be increased, but the temperature of the semiconductors increases excessively
Solution Approach 1:
The invention transitions from one-dimensional heat transfer (direct contact between base plate and heat sink) to two-dimensional heat distribution by embedding heat pipes within the base plate structure. This allows heat to be conducted laterally through the heat pipe network before being dissipated vertically through the heat sink, effectively spreading heat over a larger area and reducing peak temperatures.
Solution Approach 2:
Heat pipes are introduced as intermediary thermal conduction elements between the semiconductor switches and the heat sink. These heat pipes act as thermal mediators that efficiently transport heat laterally across the base plate and transfer it to the heat sink, improving the overall thermal management system's effectiveness.
2Reliability
If the mass of the cooling arrangement is increased to improve heat removal, then the cooling efficiency increases, but the device becomes more complex and heavier
Solution Approach 1:
The invention merges the heat pipes with the base plate structure, creating an integrated thermal management system. The heat pipes are embedded within the base plate itself rather than being separate external components, which reduces overall system complexity while maintaining effective heat removal capabilities.
Solution Approach 2:
The heat pipes are nested within the base plate structure, with the cooling channels embedded inside the solid base plate material. This nested configuration allows the cooling system to be compact and integrated, reducing the overall footprint and complexity of the cooling arrangement while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases the cooling efficiency of semiconductor components, enabling higher switching frequencies and greater cyclic loading capacity without reducing output power, while maintaining lower temperatures and faster thermal response times.
Implementation Method 1
a carbon based material layer (3), which is arranged between the base plate (13) of the power electronic module and the cooling surface of the cooling arrangement and is adapted to spread the heat generated by the semiconductor power electronic switch components in addition to transferring the heat to the cooling arrangement
Implementation Method 2
Heat pipes operate in a known manner absorbing heat when liquid inside a pipe evaporates to a gas
Implementation Method 3
The evaporated gas moves inside the pipe towards a cooler place and condenses again into liquid thereby releasing heat
Implementation Method 4
The liquid moves again towards the warmer direction with the aid of capillary and gravity forces
Implementation Method 5
The liquid moves again towards the warmer direction with the aid of capillary and gravity forces
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
A power electronic assembly and a method of producing a power electronic assembly. The assembly comprising a power electronic module having multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, the power electronic assembly comprising further a cooling arrangement for cooling the power electronic module. The cooling arrangement comprises a cooling surface adapted to be attached against the base plate of the power electronic module, wherein the cooling arrangement comprises further one or more heat pipes formed in the cooling surface for spreading the heat in the cooling arrangement and removing the heat from the cooling arrangement. The power electronic assembly comprises further a carbon based material layer arranged between the base pate of the power electronic module and the cooling surface of the cooling arrangement, the carbon based material layer being adapted to spread the heat generated by the semiconductor power electronic switch components and to transfer the heat from the power electronic assembly to the cooling arrangement.