Semiconductor Assembly With Elastic Buffer for Detachable Power Contacts
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Solution Overview
Problem
Existing semiconductor arrangements face challenges in recyclability and repairability due to the use of material-bonded connections that are difficult or impossible to detach, limiting the ability to efficiently disassemble and reuse components.
Innovation Solution
Implementing a semiconductor assembly with friction-fit connections using planar assembly and interconnection technology, where semiconductor elements are positively connected between circuit carriers via fastening means, with an elastic buffer layer compressed perpendicular to the element, allowing for detachable and damage-free disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If material-bonded connections (soldering, sintering, welding) are used to connect semiconductor elements to circuit carriers, then electrical connection reliability is improved, but recyclability and repairability deteriorate due to difficulty in detachment
Solution Approach 1:
The connection system is segmented into two distinct functional parts: a permanent material-bonded electrical connection between the semiconductor element and the circuit carrier, and a separate mechanical fastening system using fastening means that can be detached. This segmentation allows the electrical connection to remain reliable while the mechanical attachment can be easily removed for recycling or repair purposes.
Solution Approach 2:
Different connection qualities are applied to different parts of the assembly: material-bonded connections are used specifically at the electrical contact points between semiconductor elements and circuit carriers to ensure electrical reliability, while mechanical fastening means are used for the structural attachment that requires detachability. This local differentiation of connection types resolves the contradiction between reliability and ease of repair.
2Ease of repair
If friction-fit connections with fastening means are used to improve recyclability, then ease of disassembly is improved, but contact pressure stability may worsen without proper buffering
Solution Approach 1:
An elastic buffer layer is introduced between the fastening means and the semiconductor element/circuit carrier interface to compensate for variations in contact pressure. This buffer layer pre-absorbs mechanical stresses and maintains stable electrical contact pressure despite changes in assembly conditions, temperature, or fastening force variations, thereby ensuring reliability while allowing easy disassembly.
3Reliability
If elastic buffer layer is compressed to maintain constant contact pressure, then electrical contact uniformity is improved, but assembly complexity increases
Solution Approach 1:
The elastic buffer layer serves multiple functions simultaneously: it maintains constant contact pressure for uniform electrical contact, compensates for manufacturing tolerances, absorbs thermal expansion differences, and provides mechanical cushioning. By consolidating these multiple functions into a single component, the solution improves electrical contact uniformity without proportionally increasing assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a substantially constant contact pressure and uniform electrical contact over a wide temperature range, facilitating easy recycling and repair by eliminating material-bonded connections.
Implementation Method 1
an elastic buffer layer is arranged between the first circuit carrier and the first load contact of the semiconductor element and/or between the second circuit carrier and the second load contact of the semiconductor element, wherein the semiconductor element is positively connected between the circuit carriers by means of fastening means, wherein a force acting perpendicular to the semiconductor element is transmitted via the fastening means, and wherein the elastic buffer layer is compressed in the direction of the force
Data Source
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AI summary
The invention relates to a method for manufacturing a semiconductor arrangement (2), in particular a power semiconductor arrangement for a power converter (56), comprising at least one semiconductor element (4), a first circuit carrier (6) and a second circuit carrier (8).To improve the recyclability or repairability of a semiconductor assembly realized using planar assembly and interconnection technology, it is proposed that the semiconductor element (4) has a first load contact (10) and a second load contact (12) on a side opposite the first load contact (10), wherein an elastic buffer layer (28) is arranged between the first circuit carrier (6) and the first load contact (10) of the semiconductor element (4) and/or between the second circuit carrier (8) and the second load contact (12) of the semiconductor element (4), wherein the semiconductor element (4) is force-fitted between the circuit carriers (6, 8) by means of fastening means (32), wherein a force (F) acting perpendicular to the semiconductor element (4) is transmitted via the fastening means (32), and the elastic buffer layer (28) is compressed in the direction of the force (F).