Asymmetric Semiconductor Bonding Pad Layout for Probe Inspection
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Solution Overview
Problem
In semiconductor devices with parallel arrays of I/O cells and external connection terminals, the uneven lengths of bonding wires and probe needle contact issues lead to characteristic deterioration and inaccurate electrical inspections, particularly due to the limited space and increased distance between adjacent terminals.
Innovation Solution
The semiconductor device is designed with first and second external connection terminals arranged in close proximity in two rows, with the second terminal positioned above the boundary of two adjacent first I/O cells, allowing for shorter separation distances and distinct bonding and inspection areas to prevent probe needle contact issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If bonding pads are arranged in parallel rows to increase integration density, then the number of external connection terminals increases, but the distance between adjacent terminals becomes uneven causing characteristic deterioration
Solution Approach 1:
The patent applies asymmetry by intentionally designing different spacing relationships between terminals in adjacent rows. Specifically, terminals in the first row are positioned at different distances from corresponding terminals in the second row, creating an asymmetric pattern that prevents probe needle contact issues while maintaining high integration density. This asymmetric arrangement ensures that probe needles contact only the intended terminals during electrical inspection.
2Area of moving object
If bonding pads are miniaturized to reduce chip size, then integration density increases, but probe needle electrical connection becomes insufficient due to protruding probe traces
Solution Approach 1:
The patent transitions from a single-row arrangement to a multi-row asymmetric arrangement of bonding pads. By distributing terminals across multiple rows with carefully controlled asymmetric spacing, the design maintains adequate electrical connection area for probe needle contact even as individual pad sizes are reduced for miniaturization. The asymmetric positioning ensures probe traces remain within pad boundaries.
3Quantity of substance
If I/O cells are arranged in two rows to increase integration, then the number of external connection terminals doubles, but bonding wire lengths become significantly uneven causing characteristic deterioration
Solution Approach 1:
The patent resolves the bonding wire length uniformity issue by implementing asymmetric positioning of terminals in the two rows. Rather than creating symmetric rows with equal spacing, the design positions terminals at deliberately different distances from reference points, which compensates for the uneven wire lengths and prevents characteristic deterioration while maintaining high I/O cell density.
Data Source
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AI summary
A first external connection terminal (14) at a first row (2) is disposed to position at upside of a first I/O cell (12), and a second external connection terminal (15) at a second row (3) is formed at upside of a boundary portion between two adjacent first I/O cells (12). Here, the first external connection terminal (14) and the second external connection terminal (15) are disposed to be separated for a predetermined distance so as not to have an overlapped portion with each other, and formed in an identical layer. According to the constitution, it is possible to prevent disadvantages such as characteristic deterioration of a semiconductor integrated circuit and accuracy deterioration of an electrical inspection while fully securing an electrical connection of probe needles with the first external connection terminal (14) and the second external connection terminal (15) at the electrical inspection time, and enabling higher integration and higher function of a semiconductor chip (1) by shortening a distance between the adjacent first external connection terminal (14) and second external connection terminal (15) at the first row (2) and the second row (3) as much as possible.