Semiconductor Device Asymmetric Gap Resin Encapsulation
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Solution Overview
Problem
The reliability of resin injection between a semiconductor chip and an interconnect substrate is compromised due to tilting of the semiconductor chip, leading to uneven gap lengths and incomplete resin filling, which affects the reliability of the encapsulation process.
Innovation Solution
The semiconductor chip is mounted on the interconnect substrate such that the gap between the chip and the substrate progressively increases from one side to the other, allowing for controlled resin injection by starting from the wider side, using pads with varying contact surface areas and solder bumps made of the same material to ensure consistent bonding and resin flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the semiconductor chip is mounted with an irregular tilt, then the gap length between the chip and substrate becomes uneven, but the reliability of resin injection is reduced
Solution Approach 1:
The patent applies asymmetry by intentionally designing an uneven gap structure where the gap width varies progressively from one side to the other. This asymmetric gap configuration allows resin to flow smoothly from the wide side to the narrow side, preventing air entrapment and improving injection reliability, while still meeting electrical insulation requirements
2Device complexity
If the gap between the semiconductor chip and interconnect substrate is filled with mold resin for encapsulation, then the encapsulation process is simplified, but incomplete resin filling occurs due to tilting
Solution Approach 1:
The patent applies preliminary action by pre-configuring the gap structure before resin injection. The uneven gap is designed in advance to guide resin flow from the wide side to the narrow side, ensuring complete filling before the encapsulation process begins, thereby simplifying the overall manufacturing process
Data Source
AI summary
A semiconductor device includes an interconnect substrate having a plurality of pads formed on a first surface thereof, a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface, a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes, and a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface, wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.