Semiconductor Element Asymmetric Window Pattern Identification
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Solution Overview
Problem
The existing semiconductor elements with planar structures face challenges in distinguishing between semiconductor chips with different resistance values, leading to potential errors in assembly production due to similar chip sizes and pad sizes, making it difficult to confirm the correct semiconductor element during the assembly process.
Innovation Solution
A semiconductor element design featuring first and second external electrodes with protective film windows exhibiting two-fold rotational symmetry and asymmetry with respect to the center line, allowing for the capture and comparison of diagonal lengths to differentiate between chips, and a method for identifying semiconductor elements by registering and comparing diagonal lengths between reference and target chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor elements with same chip size and pad size are manufactured using the same process, then manufacturing efficiency is improved, but identification accuracy deteriorates making it difficult to distinguish between different resistance values
Solution Approach 1:
The patent introduces asymmetric window patterns in the protective film of semiconductor elements. Specifically, the first window has different dimensions or positioning relative to the second window, creating an asymmetric configuration that varies according to resistance value categories. This asymmetric design enables visual or automated optical identification of different resistance values while maintaining uniform chip sizes and manufacturing processes, thus resolving the contradiction between manufacturing efficiency and identification accuracy.
2Productivity
If semiconductor elements are stored in trays and mounted in the same assembly production process, then production flow is improved, but error risk increases due to difficulty in confirming correct elements
Solution Approach 1:
The patent employs visual differentiation through asymmetric window patterns that can be detected during assembly. The asymmetric configuration of windows in the protective film creates distinct visual signatures for different resistance value categories, enabling operators or automated systems to quickly verify correct element selection and placement, thereby reducing errors while maintaining efficient production flow.
3Manufacturing precision
If resistance value is adjusted by changing length and width of resistive layer pattern, then resistance control is improved, but identification difficulty increases due to similar overall dimensions
Solution Approach 1:
The patent segments the identification function from the resistive element itself by introducing separate window patterns in the protective film. The windows are positioned and dimensioned asymmetrically to encode resistance value information, while the actual resistive layer can be optimized for precise resistance control without affecting identification. This segmentation allows independent optimization of both resistance precision and identification ease.
Solution Approach 2:
By creating asymmetric window configurations that correspond to different resistance value categories, the patent enables easy visual or optical identification of resistance values without requiring changes to the chip dimensions or resistive layer geometry. This maintains precise resistance control while eliminating identification difficulties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate identification of semiconductor elements based on diagonal length differences, reducing errors in assembly production by distinguishing between semiconductor chips with different resistance values, even when they share the same chip size or pad size.
Implementation Method 1
an imaging device to capture an image of the semiconductor chip
Data Source
AI summary
A semiconductor element encompasses a first external electrode on an upper surface side of a semiconductor chip, a second external electrode, spaced apart from the first external electrode, provided in parallel with the first external electrode; and a protective film covering the first and second external electrodes, having first and second windows to expose portions of upper surfaces of the first and second external electrodes, respectively. Planar patterns of the first and second windows are in two-fold rotational symmetry with respect to a center point of an area including the first and second external electrodes and to be asymmetric with respect to a center line between the first and second external electrodes.