Semiconductor Module Auxiliary Wiring for Heat-Cycle Disconnection Detection
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Solution Overview
Problem
The disconnection of control wiring due to heat cycling in semiconductor modules leads to operational instability and potential destruction of the apparatus.
Innovation Solution
A dual auxiliary wiring system is implemented, where a first auxiliary wiring is connected close to the semiconductor device and a second auxiliary wiring is spaced apart, allowing for early detection of disconnection by detecting a shift in switching timing when the first auxiliary wiring fails.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a thin bonding wire is used for control wiring to reduce current consumption, then the wiring is more susceptible to heat cycle deterioration and disconnection
Solution Approach 1:
The patent provides preliminary detection capability by monitoring voltage between the auxiliary electrode and reference electrode before actual disconnection occurs. The detection circuit identifies potential connection issues early in the heat cycle process, allowing preventive action before complete wiring failure happens.
Solution Approach 2:
The patent introduces an auxiliary electrode and reference electrode as intermediary elements to detect wiring status. These electrodes serve as mediators between the control wiring and the detection circuit, enabling indirect monitoring of wiring integrity without interfering with normal operation.
2Speed
If control wiring is connected close to the semiconductor device to reduce inductance, then the wiring is more exposed to heat and more likely to deteriorate
Solution Approach 1:
The patent implements a feedback mechanism where the detection circuit continuously monitors the voltage between auxiliary and reference electrodes. This feedback provides real-time information about wiring condition, enabling the system to detect deterioration caused by heat exposure and trigger appropriate responses.
Solution Approach 2:
The auxiliary electrode acts as an intermediary that is strategically positioned to monitor wiring status without being directly in the primary heat path. This intermediary element provides protection by detecting issues before they affect critical control functions.
Data Source
AI summary
A semiconductor module includes a laminate substrate including a first circuit board on which a semiconductor device having a plurality of upper surface electrodes including a main electrode is disposed and a second circuit board, a main terminal electrically connected to the main electrode, an auxiliary terminal electrically connected to the one of the upper surface electrodes, and a main current wiring member electrically connecting the main electrode to the main terminal. A first path through which a first control current flows and a second path through which a second control current flows are provided between the one of the plurality of upper surface electrodes and the auxiliary terminal. The first control current flows via a first auxiliary wiring, and the second control current flows via the main current wiring member, the second circuit board and a second auxiliary wiring in this order.