Semiconductor Device Backside Conductive Pathways for Wire Bonding
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Solution Overview
Problem
The existing semiconductor device manufacturing process is complicated due to the opposite orientations of external connection terminals, which complicates the wire bonding process.
Innovation Solution
The semiconductor device design includes conductive portions that extend from the back surface of the second semiconductor substrate to reach the electrode pads on the first semiconductor substrate, allowing for simplified assembly by enabling wire bonding on the same side for both chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed for external connection terminals oriented in opposite directions, then electrical connection between chips is achieved, but the bonding process becomes complicated
Solution Approach 1:
The patent applies asymmetry by orienting both external connection terminals in the same direction rather than in opposite directions. This asymmetric configuration simplifies the wire bonding process while maintaining electrical connection reliability between the first and second external connection terminals.
Solution Approach 2:
The patent inverts the conventional approach by having both terminals face the same direction instead of opposite directions. This inversion of the terminal orientation arrangement simplifies the bonding process complexity while achieving the same electrical connection function.
2Ease of manufacture
If conductive portions extend through the second semiconductor substrate to reach electrode pads, then assembly process is simplified, but manufacturing complexity increases
Solution Approach 1:
The conductive portions are formed in advance within the second semiconductor substrate during the chip fabrication process, before the stacking assembly. This preliminary formation of conductive pathways simplifies the subsequent assembly process, as the electrical connections are already prepared and aligned.
Solution Approach 2:
The conductive portions extend in the vertical dimension through the second semiconductor substrate, creating three-dimensional electrical pathways. This dimensional approach allows simplified planar assembly while managing the complexity through vertical integration during manufacturing.
Data Source
AI summary
The semiconductor device includes a first semiconductor substrate, a first wiring layer, a second wiring layer, a second semiconductor substrate, a first conductive portion, and a second conductive portion. The first wiring layer includes a first electrode pad and a first inductor electrically connected with each other. The second wiring layer includes a second inductor and a second electrode pad electrically connected with each other. The first conductive portion is formed in the second semiconductor substrate, the second wiring layer, and the first wiring layer so as to reach the first electrode pad from the back surface of the second semiconductor substrate. The second conductive portion is formed in the second semiconductor substrate and the second wiring layer so as to reach the second electrode pad from the back surface of the second semiconductor substrate. The first inductor and the second inductor are disposed so as to face each other.