Semiconductor Package Baffle Structures Mitigate Solder Bridging
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Solution Overview
Problem
In three-dimensional integrated circuits (3DIC) packaging, the reduction of solder bump pitch leads to increased risks of unintended short circuits due to bridging between adjacent bumps, and die warpage causes inadequate bonding and compression forces that deform solder layers, resulting in bridging issues.
Innovation Solution
The implementation of baffle structures on the periphery regions of the semiconductor package to reinforce against compression forces, preventing bridging between solder bumps and ensuring proper bonding by distributing mechanical stress and maintaining structural integrity during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If solder bump pitch is reduced to increase wiring density, then device integration density is improved, but the risk of unintended short circuits increases due to bridging between adjacent bumps
Solution Approach 1:
The patent introduces a third bump structure positioned between adjacent first and second bumps as an intermediary element. This third bump acts as a physical barrier and stress distributor, preventing direct contact and bridging between the first and second bumps while maintaining the reduced pitch configuration for high wiring density.
Solution Approach 2:
The patent segments the bonding interface by introducing additional third bumps between the primary first and second bumps. This segmentation divides the continuous stress field into discrete zones around each bump, preventing the propagation of compression forces that would otherwise cause bridging between adjacent bumps.
2Ease of manufacture
If die warpage is present during bonding, then manufacturing complexity is reduced, but compression forces deform solder layers causing bridging issues
Solution Approach 1:
The patent performs preliminary action by pre-positioning the third bumps between the first and second bumps before the bonding process. This advance preparation ensures that when compression forces occur during bonding due to die warpage, the third bumps are already in place to distribute these forces and prevent solder layer deformation and bridging.
Solution Approach 2:
The third bump structures serve as beforehand cushioning elements that absorb and distribute compression forces generated during bonding. By having these additional bumps in place prior to bonding, the system cushions against the harmful effects of die warpage and prevents solder bridging between adjacent bumps.
3Strength
If compression forces are applied during bonding to ensure adequate bonding, then bonding strength is improved, but solder layers deform resulting in bridging between adjacent bumps
Solution Approach 1:
The third bump structures act as intermediary elements between adjacent first and second bumps. During bonding, these third bumps mediate the compression forces by providing additional contact points and stress distribution paths, allowing adequate bonding strength to be achieved while preventing the direct force transmission that causes bridging between first and second bumps.
Solution Approach 2:
The patent applies local quality by strategically placing third bumps in specific locations between the first and second bumps. This localized addition of bump structures creates regions of enhanced stress distribution precisely where bridging is most likely to occur, allowing compression forces to be applied for strong bonding without causing bridging in critical areas.
Data Source
AI summary
A semiconductor package structure includes a first package, a second package over the first package, a plurality of connectors between the first package and the second package and a plurality of baffle structures between the first package and the second package. The second package includes a bonding region and a periphery region surrounding the bonding region. The connectors are disposed in the bonding region to provide electrical connections between the first package and the second package. The baffle structures are disposed in the periphery region and are separated from each other.