Semiconductor Package Ball Map Layout for Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packages face challenges in maintaining signal integrity and power integrity due to high signal density and noise, particularly when data and command/address signals are not adequately separated and dispersed across the package substrate.
Innovation Solution
The semiconductor package design includes a base substrate with a controller package and a memory package mounted apart, featuring a package ball map with data, command/address, and ground signals arranged in a manner that separates data signals from command/address signals and surrounds them with ground signals, thereby increasing signal integrity and power integrity by dispersing signals across multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If data signals and command/address signals are arranged in high-density package ball maps, then signal capacity increases, but signal integrity deteriorates due to noise and interference
Solution Approach 1:
The package ball map is segmented into distinct regions: a first region for data signals and a second region for command/address signals. This spatial segmentation separates different signal types to reduce interference while maintaining high signal capacity through optimized regional arrangement.
Solution Approach 2:
Different regions of the package ball map are assigned different signal types with specific arrangement characteristics. The first region optimizes for data signal transmission while the second region optimizes for command/address signal transmission, allowing each region to have tailored local quality for its specific signal type.
2Adaptability or versatility
If multiple signal types are densely packed in the package ball map, then package functionality increases, but power integrity deteriorates due to ground signal interference
Solution Approach 1:
A third region for ground signals is introduced as an intermediary between the first region (data signals) and the second region (command/address signals). This ground signal region acts as a mediator that provides reference potential and reduces electromagnetic interference, thereby maintaining power integrity while supporting multiple signal types.
3Area of stationary object
If packages are mounted close together on the base substrate, then substrate area utilization increases, but noise interference between packages increases
Solution Approach 1:
The base substrate is segmented into distinct mounting regions for first packages and second packages. This segmentation allows packages to be mounted close together for high area utilization while maintaining spatial separation of signal pathways to reduce noise interference between adjacent packages.
Data Source
AI summary
Provided is a semiconductor package including a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal direction, wherein the second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arranged in a plurality of rows and a plurality of columns, each of which has one signal arranged therein, wherein the package ball map includes a first signal, or a data signal, arranged in at least some cells among the cells of the package ball map, and a second signal, or a command or address signal, and the first signal is arranged apart from the second signal.