2D Barcode Semiconductor Package Defect Tracing
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Solution Overview
Problem
Conventional methods for managing semiconductor products struggle to quickly investigate the cause of defects in the manufacturing process, especially as the complexity of semiconductor product types and manufacturing steps increases, limiting the ability to rapidly identify and address issues.
Innovation Solution
A manufacturing method that involves affixing a two-dimensional bar code to the outer frame portion of semiconductor packages, which is readable and linked to intra-server information stored in a server, allowing for tracing of manufacturing conditions and defect identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional product management methods are used with simple marking, then manufacturing process is simple, but defect investigation speed is slow
Solution Approach 1:
The patent transitions from conventional one-dimensional linear barcodes to two-dimensional matrix barcodes, enabling significantly increased information storage capacity. This dimensional change allows the barcode to contain comprehensive manufacturing data including wafer number, chip position, and process information, thereby enabling rapid defect investigation without increasing system complexity
Solution Approach 2:
The patent creates a digital copy of all manufacturing process data and stores it in a server, with the two-dimensional barcode serving as a reference key. This copying approach allows instant retrieval of manufacturing conditions by scanning the barcode, dramatically reducing defect investigation time while keeping the physical marking simple
2Loss of information
If detailed product information is marked on the package surface, then defect tracing capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts detailed manufacturing information from the physical package and stores it in a separate server database. The two-dimensional barcode on the package surface serves only as a retrieval key, containing minimal marking data but providing access to comprehensive manufacturing records. This separation reduces package marking complexity while maintaining full information accessibility
Solution Approach 2:
The two-dimensional barcode acts as an intermediary between the physical package and the digital manufacturing database. Instead of marking all detailed information directly on the package, the barcode serves as a mediator that links the physical product to its digital twin in the server, enabling easy information retrieval without increasing physical marking complexity
Data Source
AI summary
A management method is able to quickly investigate the cause of a defect generated in a semiconductor product manufacturing process. Manufacturing conditions in various QFP manufacturing steps are stored in a main server while correlating them with an identification number of the QFP, and a two-dimensional bar code corresponding to the identification number is stamped to the surface of the QFP. In the event of occurrence of a defect of the QFP, the manufacturing conditions for the QFP stored in the main server can be traced in an instant by reading the two-dimensional bar code of the QFP and thereby specifying the identification number.