Power Semiconductor Barrier Region for Low-Loss Gate Oxide Robustness

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Solution Overview

Problem

Power semiconductor devices face challenges in achieving a balance between long-term stability and robustness to gate insulator degradation while maintaining low static loss, particularly in high-frequency and harsh switching conditions.

Innovation Solution

Incorporating a barrier region between the drift region and the extraction electrode, which is surrounded by the barrier region, effectively shields additional extraction contacts, reducing detrimental effects on the on-state while enhancing robustness to gate oxide degradation and minimizing static loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional extraction contacts are added to improve robustness to gate insulator degradation, then long-term stability is improved, but static loss increases due to detrimental effects on the on-state

Engineering Contradiction:
Improverobustness to gate insulator degradationVSAvoidstatic loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

A barrier region is introduced as an intermediary structure between the drift region and the extraction electrode. This barrier region acts as a mediator that shields the extraction electrode from directly affecting the drift region, thereby reducing the detrimental impact on on-state performance while maintaining the extraction electrode's function in improving robustness to gate insulator degradation

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The barrier region is specifically positioned only in the area where the extraction electrode interacts with the drift region, creating a localized protective structure. This allows the extraction electrode to maintain its beneficial effects on gate insulator degradation robustness while the barrier region locally mitigates the negative impact on on-state characteristics, thus reducing static loss

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12199144B2Power semiconductor device and manufacturiing method
Publication Date: 2025.01.14 HITACHI ENERGY LTD
  • US12199144B2 patent drawing
  • US12199144B2 patent drawing
  • US12199144B2 patent drawing

AI summary

A power semiconductor device comprises a semiconductor body, a gate electrode, and an extraction electrode, wherein the semiconductor body comprises a source region of a first conductivity type, well region of a second conductivity type different from the first conductivity type at the gate electrode, a drift region which is of the first conductivity type, and a barrier region which is of the first conductivity type, the barrier region is located between the drift region and the extraction electrode.