Semiconductor Package Barriers for Underfill Keep-In Zones
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Solution Overview
Problem
Existing semiconductor devices face challenges in containing materials like underfill and adhesive within narrow boundaries due to the need for larger keep-out-zones (KOZs), which occupy valuable space and hinder functionality enhancement.
Innovation Solution
Implementing barriers formed by walls made of small molecules, oligomers, polymers, or inorganic materials, using jetting or extrusion techniques, to create a keep-in-zone (KIZ) that confines these materials, allowing for smaller KOZs and increased functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional KOZ methods are used to contain materials, then material containment is achieved, but the KOZ occupies valuable space and limits device functionality
Solution Approach 1:
The barrier structure is segmented into multiple components including side walls, top surfaces, and integrated encapsulants that work together to contain materials. This segmentation allows the barrier to effectively contain materials within a smaller area, reducing the required KOZ size while maintaining containment reliability
Solution Approach 2:
The barrier acts as an intermediary structure between the material to be contained and the surrounding environment. By introducing this intermediate barrier layer, the patent achieves effective material containment with reduced KOZ area, resolving the contradiction between containment reliability and space occupation
2Adaptability or versatility
If KOZ size is reduced to increase functionality, then more components can be packed, but material containment becomes more difficult
Solution Approach 1:
The barrier structure exhibits local quality variations with different materials and geometries at different locations. Side walls provide vertical containment, top surfaces provide horizontal containment, and integrated encapsulants provide additional sealing. This localized optimization enables precise material containment within smaller areas, allowing increased device functionality without sacrificing containment precision
Solution Approach 2:
The barrier is constructed using composite material systems including polymers, ceramics, metals, and integrated encapsulants. These composite materials provide enhanced containment performance with superior chemical resistance, mechanical strength, and sealing properties, enabling precise material containment in reduced KOZ areas that support higher device functionality
Data Source
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AI summary
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including one or more barriers to form a keep-out-zone or a keep-in-zone. In various embodiments, system include a substrate including a first layer, a wall coupled to a first surface of the first layer, and a material coupled to the first surface of the first layer. The wall can be configured to block the material from flowing or expanding outside of the wall.