Semiconductor Package Base Layout for Dual-Sided Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat generated by semiconductor elements, particularly when heat dissipation is concentrated in regions between multiple elements mounted on a lead frame, leading to degraded performance.
Innovation Solution
The semiconductor device design includes a base with exposed top and bottom surfaces, allowing heat generated by the semiconductor element to be dissipated through both surfaces, with the base thermally connected to external heat sinks for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor element is mounted on the front surface of the lead frame, then the semiconductor element can be electrically connected to external terminals, but heat dissipation becomes concentrated in the region between multiple elements leading to degraded performance
Solution Approach 1:
The invention transitions from single-sided mounting to dual-sided mounting by exposing both the front and back surfaces of the lead frame. Semiconductor elements are mounted on both surfaces, creating a three-dimensional arrangement that distributes heat generation across multiple spatial dimensions. This dimensional expansion allows heat to dissipate through multiple pathways simultaneously, resolving the heat concentration problem while maintaining electrical connection reliability through proper routing of connection portions between the front and back surfaces.
2Adaptability or versatility
If multiple semiconductor elements are mounted on the lead frame, then device functionality is enhanced, but heat dissipation becomes concentrated leading to degraded performance
Solution Approach 1:
The lead frame is segmented into multiple independent mounting regions on both the front and back surfaces. Each region can accommodate semiconductor elements independently, allowing the device to be configured for different functional requirements. This segmentation enables versatile device functionality while distributing heat generation across multiple separated regions, preventing heat concentration and improving overall heat dissipation performance.
3Device complexity
If heat dissipation is concentrated in a specific region, then the structure is simplified, but heat dissipation performance is degraded
Solution Approach 1:
The invention utilizes the third dimension by exposing and utilizing both the front and back surfaces of the lead frame for heat dissipation. Connection portions extend between the front and back surfaces to electrically connect semiconductor elements mounted on different faces. This spatial arrangement distributes heat dissipation across multiple surfaces and pathways, improving heat dissipation performance without significantly increasing structural complexity, as the connection portions naturally follow the existing lead frame geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation from both the top and bottom surfaces of the base, dispersing heat to external heat sinks, thereby improving the overall heat dissipation performance of the semiconductor device.
Implementation Method 1
allowing heat generated by the semiconductor element to be dissipated through both surfaces, with the base thermally connected to external heat sinks for efficient heat dissipation
Data Source
AI summary
A semiconductor device includes: a package having a top surface and a bottom surface; a semiconductor element arranged in the package; and a base which is arranged in the package and on which the semiconductor element is mounted. A top surface of the base is exposed to the top surface of the package, and a bottom surface of the base is exposed to the bottom surface of the package.