Ultrasonic Joining Fixation for Semiconductor Base Plate Stability
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Solution Overview
Problem
Existing ultrasonic joining methods for semiconductor devices, such as power semiconductor modules, face instability in joining structural members due to inadequate fixation, leading to unreliable connections.
Innovation Solution
An apparatus comprising a plate-type tool with a first and second fixing tool having inclined surfaces that securely fix the base plate and apply ultrasonic vibration in the width direction, ensuring stable joining by forming pressed dents on the base plate's edges, thereby enhancing the tensile strength of the external terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional ultrasonic joining methods are used without secure fixation, then the joining process can be performed, but the joining state becomes unstable due to rattling and warping of structural members
Solution Approach 1:
The base plate is fixed to the anvil surface before ultrasonic joining occurs. This preliminary fixation prevents rattling and warping during the joining process, ensuring stable connection between structural members while maintaining a relatively simple device structure.
Solution Approach 2:
The anvil serves as an intermediary component between the ultrasonic horn and the base plate. It provides a stable support surface that secures the base plate during ultrasonic vibration, preventing instability without requiring complex fixation mechanisms.
2Reliability
If pressing tools are used to fix the base plate, then some stability is achieved, but the fixation is insufficient and joining state remains unstable
Solution Approach 1:
The base plate itself serves its dual function as both the workpiece and the fixed component. By fixing the base plate directly to the anvil, the system eliminates the need for separate pressing tools, achieving stable fixation while maintaining manufacturing simplicity.
3Manufacturing precision
If through holes with spring pins are used for positioning, then positioning is achieved, but rattling occurs during joining due to clearance, making joining state unstable
Solution Approach 1:
The invention removes the through-hole positioning structure with spring pins and replaces it with direct fixation of the base plate to the anvil. This eliminates the clearance-induced rattling problem while maintaining positioning accuracy through the fixed base plate configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves high reliability and stability in ultrasonic joining by securely fixing structural members, preventing rattling and warping, and optimizing the angle of the inclined surfaces for optimal tensile strength.
Implementation Method 1
an ultrasonic horn possible to apply ultrasonic vibration in the width direction of the plate member while pressing joint member toward the plate member
Implementation Method 2
a first fixing tool and a second fixing tool having an inclined surface possible to abut on an upper edge of an end part in the width direction of the plate member
Data Source
AI summary
An apparatus for a manufacturing semiconductor device including a plate member and a joint member. The apparatus includes a plate-type tool having the plate member mounted thereon, a first fixing tool and a second fixing tool having an inclined surface for abutting an upper edge of an end part in a width direction of plate member. The second fixing tool is fixed onto the plate-type tool adjacent to the end part. An ultrasonic horn applies ultrasonic vibration in the width direction of plate member while pressing the joint member toward the plate member.