Semiconductor Device Base Plate Recesses for Bonding Control
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Solution Overview
Problem
Existing semiconductor devices face reliability issues due to interfacial peeling and cracking caused by excess bonding material and residual stress, which complicates manufacturing and reduces efficiency.
Innovation Solution
The semiconductor device incorporates a base plate with groove-shaped recesses, where the bonding material is strategically placed to prevent excess material from flowing into critical areas, allowing for secure bonding and anchoring effects, thereby reducing the risk of peeling and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding material is applied to bond the metal plate to the base plate, then bonding strength is improved, but excess bonding material flows into the groove causing interfacial peeling and cracking
Solution Approach 1:
The groove is divided into two distinct regions: a first groove region that prevents bonding material from flowing onto the metal plate, and a second groove region that provides anchoring for the sealing material. This segmentation allows the bonding material to be contained within the first region, preventing peeling and cracking while maintaining bonding strength.
Solution Approach 2:
Different regions of the groove are designed with different functions: the first groove region (along the outer periphery) provides containment for the bonding material, while the second groove region (on the inner side) provides anchoring for the sealing material. This local differentiation of function resolves the contradiction between bonding strength and interface reliability.
2Reliability
If the groove is filled with sealing material to provide anchoring effect, then sealing reliability is improved, but excess bonding material causes peeling and cracking
Solution Approach 1:
The groove is segmented into two functional regions: the first groove region prevents bonding material from reaching the metal plate (avoiding peeling), while the second groove region is filled with sealing material to provide anchoring (ensuring sealing reliability). This segmentation eliminates the harmful effects while maintaining sealing integrity.
Solution Approach 2:
The harmful function (preventing bonding material flow) is extracted and assigned to the first groove region, while the useful function (providing anchoring) is extracted and assigned to the second groove region. This separation of functions resolves the contradiction between sealing reliability and prevention of peeling/cracking.
3Manufacturing precision
If bonding material is strictly controlled to prevent excess, then manufacturing precision is improved, but manufacturing efficiency decreases
Solution Approach 1:
The groove structure is designed in advance with specific geometric features (first groove region with obtuse angles, second groove region positioned inward) that automatically guide and contain the bonding material during the bonding process. This preliminary structural design eliminates the need for strict process control of bonding material quantity, thereby maintaining manufacturing precision while improving efficiency.
Solution Approach 2:
The groove structure itself serves the function of controlling bonding material distribution. The first groove region automatically contains the bonding material, and the second groove region automatically provides anchoring, without requiring external control mechanisms. This self-regulating structure resolves the contradiction between precision and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient manufacturing with high reliability by preventing excess bonding material from causing issues, ensuring secure bonding and effective sealing, and allowing for heat dissipation while minimizing voids and stress.
Implementation Method 1
a bonding material disposed between the base plate and the metal plate and in surface contact with the base plate and the metal plate so as to bond the metal plate to the base plate
Implementation Method 2
a sealing material that covers the metal plate, the bonding material, the insulating plate, the circuit member, and the semiconductor element to seal a space on the base plate
Data Source
AI summary
A semiconductor device includes a base plate; a metal plate above the base plate; a bonding material between the base plate and metal plate, bonding the metal plate to the base plate; an insulating plate on the metal plate; a circuit member on the insulating plate; a semiconductor element mounted on the circuit member; and a sealing material to seal a space on the base plate. The metal plate includes a bottom surface area along a periphery, exposed from the bonding material. The base plate includes a groove-shaped first recess formed along the periphery of the metal plate and faces the bottom surface area. The base plate also includes a groove-shaped second recess that is spaced apart from the first recess and that is formed on the inner side relative to the first recess. The bonding material is disposed in at least a part of the second recess.