Semiconductor Module Base Fixing Layout to Suppress Warping
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Solution Overview
Problem
Existing semiconductor modules face issues with warping and reduced thermal conductivity due to thermal expansion, leading to reduced heat dissipation performance and reliability, especially when attached to cooling modules.
Innovation Solution
The semiconductor module design includes a heat dissipation base with fastener holes at corners and protruding fixing portions that suppress warping by securing the module to a cooling module, maintaining thermal contact and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor module is attached to a cooling module using joining members, then heat dissipation is improved, but warping occurs due to thermal expansion causing reduced thermal conductivity
Solution Approach 1:
The patent introduces fixing portions that change the mechanical constraint parameters of the heat dissipation base, adding fixed attachment points that prevent warping while maintaining the thermal interface with the cooling module
Solution Approach 2:
The heat dissipation base is segmented to include both fastener holes at the corners and additional fixing portions at specific positions, dividing the fixation function into multiple discrete attachment points that collectively prevent warping
2Ease of manufacture
If the heat dissipation base is fixed at corner fastener holes only, then assembly is simplified, but warping occurs reducing heat dissipation efficiency
Solution Approach 1:
The fixation system is segmented into corner fastener holes for basic assembly and additional fixing portions for warping prevention, maintaining simple corner attachment while adding targeted support at specific positions along the longer sides
Solution Approach 2:
Fixing portions are strategically placed at specific locations along the longer sides of the heat dissipation base, providing localized reinforcement exactly where thermal expansion causes warping, rather than uniformly increasing fixation throughout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents warping and maintains thermal conductivity, improving the reliability and heat dissipation performance of the semiconductor module.
Implementation Method 1
a heat dissipation base (30) having a rectangular top surface (31e) on which the multiple insulated circuit boards (20a to 20f) are disposed
Implementation Method 2
Existing semiconductor modules face issues with warping and reduced thermal conductivity due to thermal expansion
Data Source
AI summary
A semiconductor module includes insulated circuit boards and a heat dissipation base having a rectangular top surface on which the plurality of insulated circuit boards is disposed, and having four fastener holes that penetrate through the heat dissipation base in a thickness direction at respective ones of corners of the top surface. The heat dissipation base further includes a pair of fixing portions each having a fixing hole penetrating therethrough in the thickness direction. The pair of fixing portions protruding, in a plan view of the semiconductor module, outwardly respectively from central parts of a pair of first edges of the top surface. The pair of first edges oppose each other and extend in a longer-side direction of the top surface.