Semiconductor Baseplate Composite Pegs Thermal Expansion
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently managing heat transfer from high-power devices to heat sinks, as existing baseplates often lack optimal thermal conductivity and compatibility with substrate materials, leading to potential device failure due to thermal mismatch.
Innovation Solution
A baseplate design featuring a planar portion made of a first material with recesses for pegs made of a second, more thermally conductive material, ensuring direct contact and similar thermal expansion coefficients to enhance heat transfer and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a baseplate is made of a single material, then the manufacturing process is simple, but the thermal conductivity and thermal expansion compatibility cannot be optimized simultaneously
Solution Approach 1:
The baseplate is constructed as a composite structure with a planar portion made of a first material and multiple pegs made of a second material. The first material provides thermal expansion compatibility with the substrate, while the second material provides superior thermal conductivity for heat transfer to the heat sink. This composite approach resolves the contradiction by combining materials with complementary properties rather than using a single material that must compromise between competing requirements.
Solution Approach 2:
Different regions of the baseplate are made from different materials optimized for their specific functions. The planar portion uses a material matched to the substrate's thermal expansion coefficient, while the pegs (which contact the heat sink) use a material with high thermal conductivity. This local differentiation allows each region to perform its specific function optimally without compromising the overall system.
2Reliability
If a baseplate uses material with high thermal conductivity, then heat transfer efficiency improves, but thermal expansion mismatch with substrate may cause mechanical failure
Solution Approach 1:
The baseplate employs a composite material system where the planar portion is made of a first material selected for its thermal expansion compatibility with the substrate, while the pegs are made of a second material selected for its superior thermal conductivity. This division allows the system to achieve both high heat transfer efficiency and thermal expansion compatibility simultaneously, resolving the contradiction between these two performance requirements.
3Device complexity
If the baseplate structure is simplified, then manufacturing cost decreases, but thermal contact with heat sink may be insufficient
Solution Approach 1:
The baseplate is segmented into a planar portion and multiple discrete pegs that fit into recesses in the planar portion. This segmentation allows the pegs to be made of a highly thermally conductive material that provides excellent thermal contact with the heat sink, while the overall structure remains relatively simple and cost-effective to manufacture. The modular design resolves the contradiction by achieving enhanced thermal performance without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat transfer efficiency by utilizing materials with high thermal conductivity and matching thermal expansion rates, preventing device failure and ensuring reliable operation of high-power semiconductor packages.
Implementation Method 1
The second material may be made of a material that may be more thermally conductive than the first material
Implementation Method 2
The first material may be made of a metal with a coefficient of linear thermal expansion close to a substrate material to which the planar portion may be configured to be coupled to
Data Source
AI summary
A semiconductor baseplate is disclosed. Specific implementations of a baseplate may include a planar portion including a plurality of recesses therein, the planar portion may be made of a first material, and a plurality of pegs where each peg of the plurality of pegs may be configured to fit within each recess of the plurality of recesses, the plurality of pegs may be made of a second material, where the first material and the second material may be bonded together.