Semiconductor Package Integrating Bidirectional Switch Circuit
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Solution Overview
Problem
Existing semiconductor device packages require multiple separate packages for bidirectional switch circuits, occupying more space on circuit boards and complicating configurations for applications like electric power conversion and plasma displays.
Innovation Solution
A semiconductor device package integrating a bidirectional switch circuit with a first and second semiconductor transistor mounted on separate die pads, connected by a conductive connector, providing a compact solution within a single package outline, such as TO-220 or TO-247, with a housing that electrically insulates and encapsulates the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple separate packages are used for bidirectional switch circuits, then electrical insulation between transistors is ensured, but the footprint area on circuit boards increases and configuration becomes complex
Solution Approach 1:
The patent combines two separate transistor packages into a single integrated package containing both transistors with their respective die pads and interconnections. This merging approach reduces the overall footprint area on circuit boards and simplifies the configuration by providing a pre-assembled bidirectional switch module that requires fewer external connections and assembly steps.
2Ease of manufacture
If multiple separate packages are used for bidirectional switch circuits, then manufacturing and assembly are simpler for individual components, but the overall device occupies more space and requires more complex circuit board layout
Solution Approach 1:
The patent integrates multiple transistor components into a single package structure, reducing the total occupied space on circuit boards. The internal arrangement of die pads and conductive connectors is optimized for manufacturing efficiency, allowing the integrated package to be produced using standardized processes while minimizing the external footprint.
3Reliability
If transistors are mounted on separate die pads, then electrical insulation is maintained, but the connection between source electrodes requires additional conductive connectors increasing device complexity
Solution Approach 1:
The patent uses conductive connectors as intermediary elements that bridge the source electrodes of transistors mounted on separate die pads. These connectors are strategically positioned and configured to provide reliable electrical connections while maintaining the necessary electrical insulation between different transistor components through the package structure.
Data Source
AI summary
In an embodiment, a semiconductor device package includes a bidirectional switch circuit. The bidirectional switch circuit includes a first semiconductor transistor mounted on a first die pad, a second semiconductor transistor mounted on a second die pad, the second die pad being separate from the first die pad, and a conductive connector extending between a source electrode of the first transistor and a source electrode of the second transistor.