Semiconductor Board Groove for Evaluation Component Removal
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Solution Overview
Problem
Semiconductor devices are hindered by the size and height increase due to connectors used for firmware writing and evaluation, which are difficult to remove after manufacturing.
Innovation Solution
A semiconductor device design featuring a groove portion in the boundary area between the product and non-product areas, allowing for the removal of evaluation components, thereby reducing the device's size and height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors are provided on the board for firmware writing and evaluation, then the functionality and reliability are improved, but the size and height of the semiconductor device increase
Solution Approach 1:
The board is divided into a product area and a non-product area, with the connectors located in the non-product area. This segmentation allows the connectors to be separated from the main product area, enabling their removal after manufacturing without affecting the core product functionality.
Solution Approach 2:
The connectors are extracted to a separate non-product area on the board, making them removable after the manufacturing process. This extraction allows the main product to be reduced in size and height by removing the connectors once their evaluation and firmware writing functions are completed.
2Ease of operation
If connectors are provided on the board, then the ease of operation for firmware writing and evaluation is improved, but the device complexity increases
Solution Approach 1:
The board structure is segmented into product and non-product areas, with connectors isolated in the non-product area. This segmentation simplifies the overall device structure by separating functional evaluation components from the core product, making the device easier to manufacture and modify.
Data Source
AI summary
A semiconductor device includes a board, an electronic component, an evaluation component, a wiring, and a groove portion. The board includes a product area, a non-product area, and a boundary area between the product area and the non-product area. The electronic component is mounted in the product area. The evaluation component is mounted in the non-product area. The wiring electrically connects the electronic component and the evaluation component. The groove portion is formed in the boundary area of the board so as to overlap at least a part of the wiring in a plan view. The non-product area is surrounded by the groove portion and at least a portion of sides of the board.