Semiconductor Board Assembly with Pull Wire for Heat-Free Removal
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Solution Overview
Problem
Existing semiconductor storage devices mounted on circuit boards via solder are difficult to remove without applying thermal load, making it challenging to manufacture or repair electronic devices without damaging the stored data.
Innovation Solution
A board unit configuration that includes a semiconductor storage device with solder balls and a wire with higher strength than the solder balls, positioned between the circuit board and the semiconductor storage device, allowing for the breaking of solder balls to facilitate easy removal without thermal load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If semiconductor storage device is mounted on circuit board via solder, then connection strength and electrical conductivity are improved, but ease of removal without thermal load deteriorates
Solution Approach 1:
The bonding structure is segmented into multiple components: solder balls for electrical connection and a wire for mechanical support. The wire is positioned between the semiconductor storage device and circuit board, creating separate functional zones where solder provides conductivity while wire provides removable mechanical strength.
Solution Approach 2:
A wire is introduced as an intermediary element between the semiconductor storage device and circuit board. This wire acts as a mediator that provides mechanical support and enables easy removal through pull-out, while allowing solder to maintain electrical connection during normal operation.
2Ease of repair
If wire with higher strength than solder balls is introduced, then ease of removal is improved, but device complexity increases
Solution Approach 1:
The wire serves multiple functions simultaneously: it provides mechanical support during operation, enables easy removal through pull-out, and prevents damage to the semiconductor storage device during removal. This multi-functionality reduces the need for additional specialized components.
Solution Approach 2:
The wire's high strength property enables it to automatically bear the mechanical load during both operation and removal processes. When pulled, the wire breaks the solder balls through its superior strength, eliminating the need for external tools or complex removal mechanisms.
3Ease of repair
If solder balls are broken to facilitate removal, then ease of removal is improved, but risk of short-circuiting increases
Solution Approach 1:
The wire is pre-positioned between the semiconductor storage device and circuit board before soldering. During removal, the wire is pulled to break solder balls in a controlled manner, ensuring that solder fragments are directed away from electrical contacts and preventing short-circuiting before it can occur.
Solution Approach 2:
The potential harm of broken solder balls causing short-circuits is converted into a benefit by using the wire's pull-out force to control the breaking process. The wire directs solder ball fragmentation away from electrical contacts, transforming what could be a harmful effect into a safe and effective removal mechanism.
Data Source
AI summary
A board unit according to an embodiment includes a circuit board, a semiconductor device, and a wire. The semiconductor device has a bottom surface facing the circuit board. The semiconductor device includes a plurality of bonding members between the circuit board and the bottom surface. The wire is disposed between the circuit board and the bottom surface. The bonding members have a first row and a second row. Two or more bonding members align in the first row in a first direction. Two or more bonding members align in the second row in the first direction. The second row is apart from the first row in a second direction intersecting with the first direction. The wire includes a first portion disposed between the first row and the second row, and the wire has a strength higher than that of one of the bonding members.