Laminated Semiconductor Board With Strain Sensing for Bond Reliability
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Solution Overview
Problem
In laminated semiconductor devices, the difference in linear expansion coefficients between the semiconductor board and through electrodes leads to strain and stress during the bonding process, causing electrical coupling failures and continuity issues.
Innovation Solution
A semiconductor device with a strain sensor integrated inside the board, where the linear expansion coefficient of the third electrodes is higher than the board, measures strain generated due to thermal expansion and contraction, and a method for manufacturing this device involving the formation of insulating layers, internal wiring, and electrodes to suppress these failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through electrodes are embedded in the semiconductor board for electrical coupling between boards, then electrical connectivity is achieved, but strain and stress occur due to difference in linear expansion coefficients between the semiconductor board and through electrodes
Solution Approach 1:
The patent changes the material parameter (linear expansion coefficient) of the through electrodes by selecting copper or copper alloy materials whose linear expansion coefficients closely match that of the semiconductor board. This parameter matching reduces thermal expansion mismatch, thereby minimizing strain and stress during temperature variations while maintaining electrical coupling reliability.
Solution Approach 2:
The patent employs composite material structures for through electrodes, using copper or copper alloys that combine electrical conductivity with thermal expansion properties matching the semiconductor board. This composite approach allows simultaneous optimization of electrical performance and mechanical stress reduction.
2Stress or pressure
If the linear expansion coefficients of through electrodes and semiconductor board are matched, then strain is reduced, but material selection becomes more constrained
Solution Approach 1:
The patent systematically evaluates and selects materials based on matching the linear expansion coefficient parameter. By focusing on copper and copper alloys, the invention identifies a material family that naturally exhibits both the required electrical conductivity and thermal expansion matching, thus resolving the contradiction between strain reduction and material flexibility.
3Reliability
If strain sensors are integrated inside the board to measure strain, then early detection of potential defects is enabled, but device complexity increases
Solution Approach 1:
The patent merges the strain sensor functionality with the existing semiconductor board structure by integrating sensors into the internal wiring layers or substrate. This consolidation allows strain measurement capability to be added without requiring separate external sensing systems, thus improving defect detection while limiting the increase in overall device complexity.
Solution Approach 2:
The integrated strain sensors serve multiple functions: they monitor thermal expansion strain, detect potential bonding defects, and provide data for quality control. This multi-functionality justifies the added complexity by delivering comprehensive reliability monitoring within a single integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The strain sensor accurately measures strain, preventing electrical coupling failures and enabling early detection of potential defects, thus improving the reliability and miniaturization of semiconductor devices.
Implementation Method 1
a strain sensor that is provided inside the first board and measures a strain generated in the first board... the difference in linear expansion coefficients between the semiconductor board and through electrodes leads to strain and stress during the bonding process
Data Source
AI summary
A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.