Semiconductor Board Terminal Exposure via Rough Plate Pressing
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor-device mounted boards are costly and limit the high-density formation of connection terminals due to the need for laser perforation and large bump intervals, which restricts finer design capabilities.
Innovation Solution
A method involving the formation of connection terminals on electrode pads, covering them with a first insulating layer, using a plate-like medium with a rough surface to expose terminals, and forming a second insulating layer with recesses, allowing for the creation of a wiring pattern that conforms to the exposed terminals without laser perforation, enabling high-density terminal formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser beam is applied to perforate the insulating layer to expose the bump, then the connection terminal can be exposed for wiring connection, but the manufacturing time increases and manufacturing cost increases
Solution Approach 1:
The insulating layer is formed with a through-hole already created before the bump formation step. This preliminary action eliminates the need for subsequent laser perforation to expose the bump, reducing manufacturing time and cost while maintaining precise exposure of the connection terminal for wiring connection
2Manufacturing precision
If laser beam with predetermined spot diameter is applied for perforation, then the insulating layer can be perforated to expose the bump, but the bump interval must be large which prevents high-density formation of connection terminals
Solution Approach 1:
The insulating layer is formed with a through-hole already created before the bump formation step. This preliminary action eliminates the constraint of laser spot diameter on bump spacing, allowing high-density formation of connection terminals while maintaining precise exposure for wiring connection
Data Source
AI summary
In a method of manufacturing a semiconductor-device mounted board, connection terminals are formed on electrode pads on a semiconductor integrated circuit respectively. A first insulating layer is formed to cover the connection terminals. A plate-like medium having a rough surface is disposed on the first insulating layer. The rough surface of the plate-like medium is pressed onto the first insulating layer so that a part of each of the connection terminals is exposed. A semiconductor device is produced by removing the plate-like medium. A second insulating layer is formed to cover side surfaces of the semiconductor device. A wiring pattern is formed to cover surfaces of the first and second insulating layers, the wiring pattern being electrically connected to the exposed connection terminal parts.