Power Semiconductor Module Bolt Pressure Application
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Solution Overview
Problem
Existing power semiconductor modules have limited current carrying capacity due to the constraints of pressure contact springs, which restrict their flexibility and compactness.
Innovation Solution
The power semiconductor module incorporates a connecting element with a bolt design, featuring a first and second end section and an intermediate section, where the second end section projects out of the housing, and a pressure application body with a rigid and elastic partial body to apply pressure to a circuit board, enhancing current carrying capacity without compromising flexibility or compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure contact springs are used to connect the circuit carrier to the cooling device, then the module achieves simple mounting and destruction-free removal, but the current carrying capacity is limited to approximately 10 A
Solution Approach 1:
The patent changes the fundamental parameters of the connecting element by replacing spring-based contact with rigid bolt connections. This parameter change enables the connecting element to carry approximately 100 A of current, representing a tenfold increase from the previous 10 A capacity of pressure contact springs.
Solution Approach 2:
The connecting element is segmented into multiple functional parts: a first end section that contacts the circuit carrier, an intermediate section with reduced cross-sectional area for current conduction, and a second end section that projects through the housing. This segmentation allows each part to be optimized for its specific function while achieving high current carrying capacity.
2Reliability
If the intermediate section of the connecting element has a small cross-sectional area to maintain compactness, then the module remains flexible and compact, but the current carrying capacity is reduced
Solution Approach 1:
The connecting element exhibits local quality variations along its length. The intermediate section has a reduced cross-sectional area (0.5-10 mm²) specifically optimized for current conduction, while the end sections have larger areas for mechanical connection. This local differentiation allows the module to achieve high current carrying capacity (approximately 100 A) while maintaining overall compactness.
3Strength
If the pressure application body applies uniform pressure to the circuit board, then thermal and mechanical connection is improved, but the complexity of the pressure application mechanism increases
Solution Approach 1:
The pressure application body is constructed as a composite structure with a first rigid partial body made of insulating material and a second elastic partial body made of elastomeric material. This composite design enables the body to apply uniform planar pressure to the circuit board for improved thermal connection, while the elastomeric portion provides self-compliance that simplifies the overall mechanism.
Solution Approach 2:
The pressure application body acts as an intermediary element between the housing and the circuit board. It translates the clamping force into uniform distributed pressure across the circuit board surface, improving thermal contact while protecting the circuit board from concentrated point loads.
4Reliability
If the connecting element is made rigid to increase current carrying capacity, then the current carrying capacity increases to approximately 100 A, but the flexibility for mounting and removal is reduced
Solution Approach 1:
The system achieves dynamic flexibility through the combination of rigid connecting elements for current conduction and elastic pressure application bodies for mounting operations. The elastomeric second partial body of the pressure application body provides compliance during clamping, enabling easy mounting and removal of the module while the rigid connecting elements maintain high current carrying capacity (approximately 100 A) during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the current carrying capacity to approximately 100 A, maintaining flexibility and compactness, with the second partial body exerting pressure in a planar fashion through the connecting element, ensuring effective thermal and mechanical connection.
Implementation Method 1
a second elastic partial body, preferably composed of a second insulating material, wherein the second partial body protrudes out of the first partial body in the direction of the housing
Implementation Method 2
the first end section rests on the circuit carrier and is electrically conductively connected thereto
Implementation Method 3
the pressure body serves for bringing about thermal and mechanical connection of the circuit carrier to a cooling device
Implementation Method 4
pressure application body and the housing are embodied in two pieces... for bringing about thermal and mechanical connection of the circuit carrier to a cooling device
Data Source
AI summary
A power semiconductor module having a pressure application body, a circuit carrier, which is embodied with a first conductor track, a power semiconductor element arranged thereon and an internal connecting device, and also having a housing which is embodied with a guide device arranged therein, with a connecting element. The connecting element is embodied as a bolt with first and second end sections and an intermediate section therebetween, wherein the first end section rests on the circuit carrier and is electrically conductively connected thereto; the second end section projects out of the housing through a cutout; and wherein the connecting element is arranged in the assigned guide device. The pressure application body has a first rigid partial body and a second elastic partial body, wherein the second partial body protrudes out of the first partial body in the direction of the housing.