Semiconductor Bond Defect Detection via Ultrasonic Interference Imaging
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Solution Overview
Problem
Existing defect detection methods for semiconductor bonding surfaces, such as those using scan-type acoustic microscopes and ultrasonic vibration with infrared thermography, are time-consuming and inefficient in detecting defects due to the need for scanning and delayed temperature rise detection.
Innovation Solution
A defect detection device that uses coherent light irradiation and ultrasonic vibration to capture images before and during vibration, detecting defects based on deviations in interference patterns caused by bonding surface vibrations, allowing for rapid defect identification without scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a scan-type acoustic microscope is used to inspect bonding surfaces, then defect detection capability is achieved, but the scanning device becomes complicated and inspection time increases
Solution Approach 1:
The patent replaces the mechanical scanning system with an optical field-based detection method. By using coherent light interference patterns and ultrasonic vibration, the system achieves defect detection without mechanical scanning, thereby simplifying the device structure while maintaining measurement precision.
Solution Approach 2:
The patent changes the detection parameter from mechanical signal scanning to optical interference pattern analysis. By monitoring changes in interference patterns caused by ultrasonic vibration, the system achieves rapid defect detection without the complexity of mechanical scanning devices.
2Measurement precision
If a scan-type acoustic microscope is used to inspect bonding surfaces, then defect detection capability is achieved, but inspection time increases
Solution Approach 1:
The patent replaces the time-consuming mechanical scanning process with a parallel optical field-based detection method. The entire inspection area is detected simultaneously through interference pattern analysis, dramatically improving inspection speed while maintaining defect detection capability.
Solution Approach 2:
The patent uses periodic ultrasonic vibration to modulate the interference pattern, enabling rapid defect detection. The periodic vibration allows the system to detect defects through temporal changes in the interference pattern rather than requiring slow spatial scanning.
3Measurement precision
If ultrasonic vibration with infrared thermography is used for defect inspection, then defect detection is possible, but there is a delay from ultrasonic wave application to temperature rise detection
Solution Approach 1:
The patent introduces coherent light as an intermediary to detect ultrasonic vibration effects. Instead of waiting for temperature rise, the system uses light interference patterns to directly detect mechanical vibrations caused by defects, eliminating the thermal delay.
Solution Approach 2:
The patent substitutes thermal detection with optical detection of mechanical vibration. By using coherent light interference to detect ultrasonic vibrations directly, the system achieves immediate defect detection without the time delay inherent in thermal methods.
4Measurement precision
If conventional ultrasonic vibration methods are used, then defect detection based on temperature rise is achieved, but the configuration becomes complex and inspection time increases
Solution Approach 1:
The patent merges ultrasonic vibration with coherent light interference in a single integrated system. By combining these two phenomena, the system achieves defect detection with a simplified configuration that does not require separate thermal detection equipment or complex scanning mechanisms.
Solution Approach 2:
The patent replaces complex thermal detection systems with a simpler optical interference-based detection system. The coherent light source and camera provide a more straightforward configuration compared to infrared thermography equipment while achieving the same defect detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate detection of defects on semiconductor bonding surfaces by analyzing image deviations, reducing inspection time and complexity while maintaining high precision.
Implementation Method 1
an exposure time when the camera images is longer than a period of ultrasonic vibration of the inspection target, and the camera obtains an image including an interference pattern that occurs due to interference of the coherent light reflected by a surface of the inspection target
Implementation Method 2
an ultrasonic vibration device, ultrasonically vibrating the inspection target
Data Source
AI summary
A defect detection device (100) that detects defects in a semiconductor device (13) comprises ultrasonic speakers (21) that ultrasonically vibrate the semiconductor device (13), a laser source (30) that irradiates the semiconductor device (13) with collimated laser light (32), a camera (40) that has an imaging element (42) which acquires images by imaging the semiconductor device (13) that has been irradiated with the collimated laser light (32), and a detection unit (55) that detects defects in the semiconductor device (13) on the basis of the images picked up by the camera (40), wherein the detection unit (55) detects defects in the semiconductor device (13) on the basis of the deviation between images acquired by the camera (40) of the semiconductor device (13) when static and when ultrasonically vibrated.