Semiconductor Package Bonded-Region Resin for Thermal Stress Resistance
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Solution Overview
Problem
Conventional semiconductor devices face malfunctions due to thermal stress, which causes detachment of the sealing resin and potential cracking of conductive members like solder and wires, leading to electrical and thermal conductivity issues.
Innovation Solution
A semiconductor device design that incorporates a resin composition with greater bonding strength than the sealing resin, covering the bonded regions between conductive members and the lead frame, preventing detachment and enhancing thermal stress resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If sealing resin is used to cover the bonded region, then the device provides basic protection, but the bonding strength is insufficient under thermal load causing detachment
Solution Approach 1:
The patent uses a composite structure consisting of sealing resin and resin composition working together. The resin composition (with higher bonding strength) is applied to the bonded region between conductive members and lead frame, while sealing resin provides overall encapsulation. This composite material approach allows the system to achieve both protection and high bonding strength under thermal load.
Solution Approach 2:
The patent applies different material properties to different regions: the resin composition with superior bonding strength is specifically applied to the bonded region where thermal stress concentrates, while the sealing resin provides general protection elsewhere. This local differentiation of material quality ensures optimal performance at the critical interface without unnecessary complexity throughout the entire device.
2Ease of manufacture
If conventional sealing resin is used, then manufacturing is simple, but thermal stress causes detachment and cracking of conductive members
Solution Approach 1:
The resin composition is applied in advance to the bonded region before final encapsulation with sealing resin. This preliminary application of high-bonding-strength material to the critical area prevents thermal stress damage before it can occur during device operation, while maintaining a relatively simple manufacturing process.
3Reliability
If resin composition with greater bonding strength is applied to bonded regions, then detachment is prevented, but device complexity increases
Solution Approach 1:
The patent applies the higher-performance resin composition only to the specific bonded regions where thermal stress concentrates, rather than throughout the entire device. This localized application improves bonding reliability at critical interfaces while minimizing the increase in overall device complexity.
Solution Approach 2:
The patent creates a composite protection system where resin composition and sealing resin work together. The resin composition provides high-bonding-strength protection at critical interfaces, while sealing resin provides overall encapsulation, achieving enhanced reliability without requiring complete redesign of the entire device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents resin detachment and cracking of conductive members under thermal loads, ensuring reliable electrical and thermal performance by improving bonding strength and reducing thermal stress.
Implementation Method 1
The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and the lead frame and also has a greater bonding strength with the conductive member than a bonding strength between the sealing resin and the conductive member
Implementation Method 2
Thermal stress due to such thermal load concentrates on the bonded region where the conductive members such as solder or a wire and the lead frame are bonded. The resin composition covering the bonded region prevents the detachment of the sealing resin due to thermal load
Data Source
AI summary
A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.