Semiconductor Bonding Adhesive Transparency Optimization
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Solution Overview
Problem
Conventional adhesives used in semiconductor bonding have low transparency due to high filler content, making it difficult for cameras to recognize patterns or position indications, which hampers the productivity of semiconductor device production.
Innovation Solution
An adhesive comprising an epoxy resin, inorganic fillers with specific particle size ranges, and a curing agent, where the inorganic fillers have a weight ratio and refractive index difference that enhances transparency while maintaining bonding reliability, allowing for better recognition of patterns or position indications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of inorganic filler is added to the adhesive to lower the linear expansion coefficient and improve bonding reliability, then the bonding reliability is improved, but the transparency of the adhesive is reduced
Solution Approach 1:
The patent changes the particle size parameter of inorganic fillers, using a mixture of fine particles (0.03-0.1 μm) and coarse particles (0.1-1 μm) in specific weight ratios. This parameter optimization allows the adhesive to maintain high transparency while achieving low linear expansion coefficient and high bonding reliability, resolving the contradiction between transparency and bonding reliability.
Solution Approach 2:
The patent creates a composite adhesive material containing epoxy resin, inorganic filler (30-70 wt%), and curing agent. The composite structure with specifically sized inorganic fillers provides both the desired optical properties (transparency) and mechanical properties (bonding reliability, low linear expansion), simultaneously addressing both requirements.
2Illumination intensity
If inorganic filler with particle size smaller than light wavelength is used to increase transparency, then the transparency is improved, but the viscosity of the adhesive increases and flowability decreases
Solution Approach 1:
The patent optimizes the particle size parameters of inorganic fillers, using a bimodal distribution with fine particles (0.03-0.1 μm) for transparency and coarse particles (0.1-1 μm) for flowability. The specific weight ratio range (1/9 to 6/4) of fine to coarse particles balances the competing requirements of transparency and flowability.
Solution Approach 2:
The patent segments the inorganic filler into two distinct particle size ranges: fine particles (0.03-0.1 μm) that provide transparency by being smaller than the light wavelength, and coarse particles (0.1-1 μm) that maintain flowability. This segmentation allows each particle size range to fulfill its specific function without compromising the other.
3Illumination intensity
If inorganic filler with particle size smaller than light wavelength is used to increase transparency, then the transparency is improved, but the coating property of the adhesive is lowered
Solution Approach 1:
The patent adjusts the particle size parameters of inorganic fillers to a specific distribution (0.03-0.1 μm and 0.1-1 μm) with controlled weight ratios. This parameter optimization ensures the adhesive maintains good coating properties while achieving high transparency, resolving the contradiction between transparency and coating property.
Solution Approach 2:
The patent develops a composite adhesive material with a specific composition: epoxy resin, inorganic filler (30-70 wt% with bimodal particle size distribution), and curing agent. This composite formulation achieves transparency while maintaining coating property through the synergistic effect of the optimized inorganic filler distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves high transparency and reliable bonding, facilitating camera recognition of patterns and improving semiconductor device productivity by optimizing the inorganic filler content and refractive index difference.
Implementation Method 1
the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4
Data Source
AI summary
The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding.The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.