Semiconductor Bonding Alignment via Imaging Feedback
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor bonding machines face inaccuracies and error sources that challenge consistent and accurate placement and bonding of semiconductor elements to bonding locations, varying between machines and applications.
Innovation Solution
A bonding machine equipped with a support structure, bond head assembly, alignment structure, imaging system, and computer system that adjusts the position of the bonding tool and support structure based on alignment markings to ensure precise placement of semiconductor elements on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding machines are used without alignment adjustment, then the bonding process is simple and fast, but the placement accuracy and bonding precision deteriorate due to machine inaccuracies and error sources
Solution Approach 1:
The system performs preliminary alignment measurements by imaging alignment markings on the substrate before the actual bonding process. The computer system calculates position adjustments based on these measurements, and the bonding tool or support structure is repositioned accordingly. This preliminary action compensates for machine inaccuracies and ensures accurate placement during bonding without requiring a completely complex bonding machine.
Solution Approach 2:
The imaging system captures images of alignment markings, and the computer system processes these images to determine the actual positions of alignment markings relative to the substrate. This feedback information is used to calculate and apply position adjustments to the bonding tool or support structure, creating a closed-loop system that compensates for machine inaccuracies and improves placement accuracy.
2Manufacturing precision
If position adjustments are made based on alignment markings, then bonding precision improves across different substrate regions, but the bonding process time increases due to imaging and calculation steps
Solution Approach 1:
The system performs alignment measurements and calculates position adjustments in advance, before the actual bonding process begins. By determining the correct positioning offsets beforehand based on alignment markings, the system eliminates the need for time-consuming adjustments during bonding, thus maintaining high precision while minimizing time loss.
Solution Approach 2:
The imaging system continuously captures images of alignment markings as the bonding tool moves across different regions of the substrate. The computer system continuously processes these images and updates position adjustments in real-time, ensuring continuous accurate bonding without interrupting the workflow. This continuous action maintains bonding precision while minimizing idle time between measurements and adjustments.
Data Source
AI summary
A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.