Semiconductor Bonding Apparatus Elastic Modulus Control

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Solution Overview

Problem

Existing semiconductor element bonding methods face challenges in ensuring consistent adhesion when using paste-like bonding materials, as variations in thickness and surface projections/depressions can lead to either protrusion of the bonding material or inadequate adhesion, affecting insulation and heat dissipation performance.

Innovation Solution

A semiconductor element bonding apparatus and method that utilize displacement and load measuring means to calculate the elastic modulus, ensuring appropriate contact and adhesion by stopping the crushing process when a predetermined elastic modulus is reached, and incorporating electrical resistance measurement for reliable contact detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bonding material is crushed to ensure adhesion, then contact between workpiece and semiconductor element is improved, but the crushing process cannot be precisely controlled

Engineering Contradiction:

Improvecontact qualityVSAvoidcrushing control

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The pressing distance detection device provides real-time feedback on the actual pressing distance, enabling the control unit to monitor and adjust the crushing process. This feedback mechanism ensures that the bonding material is crushed to the appropriate degree without over-compression, achieving both reliable contact and precise control.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces the mechanical jig-based crushing system with a more sophisticated pressing mechanism that incorporates sensing and control elements. This substitution transforms the purely mechanical crushing process into a controlled process with measurement and adjustment capabilities.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If a fixed pressing method is used, then the process is simple, but it cannot accommodate variations in thickness of semiconductor elements or workpieces

Engineering Contradiction:

Improveprocess simplicityVSAvoidthickness variation accommodation

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic adjustability to the pressing process through the pressing distance detection device and control unit. This allows the system to automatically adapt to different thickness variations while maintaining a relatively simple overall process structure, balancing ease of manufacture with adaptability.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system performs self-adjustment based on the detected pressing distance, eliminating the need for manual intervention or complex setup procedures. The control unit automatically modifies the pressing parameters according to the actual conditions, making the process adaptable without significantly increasing operational complexity.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures reliable adhesion without bonding material protrusion, regardless of variations in thickness or surface features, by evaluating adhesion using the elastic modulus and adjusting the crushing process accordingly, resulting in improved insulation and heat dissipation performance.

Implementation Method 1

load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction

Methodology Applied

Scientific EffectDisplacement: Displacement

Implementation Method 3

elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS11037901B2Semiconductor element bonding apparatus and semiconductor element bonding method

Publication Date: 2021.06.15 TOYOTA JIDOSHA KK

AI summary

Provided are a semiconductor element bonding apparatus and a semiconductor element bonding method that do not cause a bonding material to protrude and also ensure adhesion, even when there are variations in a thickness of a semiconductor element or a workpiece and even when there are projections and depressions on surfaces. A semiconductor element bonding apparatus includes disposing means for disposing a workpiece and a semiconductor element at positions facing each other, moving means for moving the workpiece or the semiconductor element in a vertical direction, displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction, load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween, and elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means.