Multilayer Semiconductor Bonding with Etched Anchoring Elements
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Solution Overview
Problem
Existing methods for bonding semiconductor functional layers often result in insufficient adhesion strength, which can impair the functionality of the layers, and existing solutions that enhance adhesion, such as using intermediate layers or increasing surface area, may compromise the layers' functionality or require complex processes.
Innovation Solution
A method involving a third intermediate layer with embedded anchoring elements, where the layer is etched to form holes filled with adhesive compound, allowing for strong mechanical bonding between the layers without significantly affecting their functionality, using a dielectric material that minimally impairs the layers' functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an intermediate layer is inserted between two functional layers to improve adhesion, then adhesion strength is improved, but functionality of the functional layers is impaired
Solution Approach 1:
The intermediate layer is segmented by forming holes through it, creating discrete regions that allow functional layers to contact each other while maintaining adhesion in other areas. This segmentation resolves the contradiction by localizing the adhesion function to specific regions rather than requiring a continuous intermediate layer.
Solution Approach 2:
The intermediate layer has non-uniform properties: in regions with holes, it provides minimal interference allowing functionality, while in regions between holes, it provides strong adhesion. This local differentiation of properties resolves the contradiction between adhesion strength and functionality preservation.
2Strength
If the surface area of the substrate is increased to improve adhesion, then adhesion strength is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
Instead of increasing the overall surface area through roughening or patterning the entire substrate, the invention segments the intermediate layer by forming holes through it. This approach achieves adhesion enhancement through localized mechanical interlocking at hole edges without requiring complex surface area increases across the entire bonding interface.
Solution Approach 2:
The holes in the intermediate layer act as intermediary structures that facilitate bonding between functional layers. These holes provide mechanical interlocking and potential adhesive pathways without requiring complex substrate surface modifications, thus resolving the contradiction between adhesion strength and process simplicity.
3Strength
If a thick layer of adhesive is used to bond layers together, then adhesion strength is improved, but the functionality of the components is impaired
Solution Approach 1:
The adhesive is confined to specific regions within holes in the intermediate layer rather than being applied as a thick continuous layer. This segmentation allows adhesive to provide strong bonding at localized points without creating a thick adhesive barrier that would interfere with the functionality of the functional layers.
Solution Approach 2:
The adhesive distribution has local quality variations: thick adhesive is present only in hole regions where it provides strong bonding, while areas between holes have minimal or no adhesive, preserving the functionality of the functional layers. This localized adhesive application resolves the contradiction between adhesion strength and functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a strong and reliable bond between semiconductor functional layers while maintaining their functionality, using anchoring elements that interlock the layers without degrading their performance, suitable for applications like sensors and conductive layer bonds.
Implementation Method 1
The holes are filled with adhesive compound. Excess adhesive compound is removed. The third layer is etched back to a predetermined thickness. Anchoring elements formed from the adhesive compound protrude from the third layer. The second functional layer is applied to the third layer, and the anchoring elements are embedded in both the third layer and the second functional layer.
Data Source
AI summary
A multilayer system includes first and second functional layers, for example, semiconductor layers. A third or intermediate layer is disposed between the first and second functional layers and adheres relatively well to the first and second layers yet has relatively little or no detrimental effect on the functionality of the first and second layers. The third layer is applied to the first layer. Anchoring elements are provided which are partly embedded in the third layer, and the second layer is secured to the third layer by the anchoring elements. This structure yields good adhesion between the three layers, because the third layer adheres relatively well to the first layer and the third layer and the second layer are mechanically bonded together relatively strongly by the anchoring elements.